Vertically Stacked Image Transducer for Multi-Waveband 3D Capture
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Solution Overview
Problem
Existing image transducers can only capture light beams within a limited wavelength range (450 nm to 750 nm) and struggle to simultaneously detect multiple light wavebands, leading to differences in pixel screens and reduced image sensing capabilities, especially in mixed bright and dim lighting conditions.
Innovation Solution
A vertically-stacked image transducer with two photosensitive layers and read circuits that filter and convert light beams across different wavebands, allowing for simultaneous detection without increasing chip dimensions, and utilizing a 3D image capturing system with computation and signal processing modules to restore pixel information and integrate depth data.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single photosensitive layer is used, then the device structure remains simple, but it can only detect light beams within a limited wavelength range (450 nm to 750 nm)
Solution Approach 1:
The patent transitions from a planar single-layer structure to a vertical stacked multi-layer structure. By stacking photosensitive layers with different spectral response characteristics vertically, the system expands the detection wavelength range without significantly increasing the horizontal chip area, effectively utilizing the vertical dimension to enhance adaptability.
Solution Approach 2:
The patent divides the single photosensitive layer into multiple segmented layers, each optimized for detecting specific wavelength ranges. This segmentation allows each layer to specialize in detecting particular spectral bands (e.g., visible, infrared, ultraviolet), thereby expanding the overall detection capability while maintaining manageable structural complexity.
2Adaptability or versatility
If multiple photosensitive layers are stacked vertically to detect multiple wavebands, then the sensing scope is expanded, but the chip dimensions increase
Solution Approach 1:
The patent utilizes the vertical dimension by stacking photosensitive layers in the depth direction rather than expanding horizontally. This vertical integration allows multiple sensing functions to be packed into a compact footprint, expanding sensing scope while minimizing increases in overall chip dimension.
Solution Approach 2:
The patent implements a nested structure where multiple photosensitive layers are integrated vertically within a single chip substrate. Each layer is positioned at different depths, creating a compact nested arrangement that maximizes sensing capability within constrained dimensional boundaries.
3Measurement precision
If waveband filtration is performed in both first and second function layers, then detection capability is enhanced, but signal processing complexity increases when both layers detect identical wavebands
Solution Approach 1:
The patent applies different filtration characteristics to different function layers based on their specific detection needs. The first function layer and second function layer can have tailored spectral transmission properties optimized for their respective photosensitive layers, allowing each local region to have quality characteristics suited to its function while maintaining overall system coherence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances image sensing capabilities and screen fineness by enabling the detection of multiple light wavebands, improving image quality and sensing scope, especially in complex lighting conditions.
Implementation Method 1
The image transducer includes two photosensitive layers and is vertically structured to simultaneously detect light beams with different wavebands
Implementation Method 2
waveband for filtration carried out in the first function layer is identical to waveband for filtration carried out in the second function layer
Data Source
AI summary
An image transducer and a 3D image capturing system having the image transducer are provided. The image transducer includes a microlens, first function layer, first photosensitive layer, second function layer, second photosensitive layer, first read circuit and second read circuit; thus, the image transducer includes two photosensitive layers and is vertically structured. The two photosensitive layers greatly increase sensing waveband. The 3D image capturing system uses the image transducer to enhance pixel screen fineness of a 3D screen.