Stacked Imaging Element With Bent Interconnects for Flexible Layout
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Solution Overview
Problem
The existing laminated imaging elements have limited flexibility in wiring layout due to conductive via connections, which restricts the arrangement of circuit units relative to pixels, leading to challenges in integrating control circuits and readout circuits effectively.
Innovation Solution
The imaging element incorporates a bent connection portion that electrically connects the readout circuit to the processing or control portion, allowing for flexible wiring layout and alignment of circuit units with pixels, even when their arrangement periods differ, by positioning the bent portion away from the substrate vicinity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conductive via connections are used to connect pixels and AD conversion portions, then electrical connection is achieved, but wiring layout flexibility is limited
Solution Approach 1:
The patent transitions from planar wiring layout to three-dimensional wiring by introducing bent portions that extend in the thickness direction between substrates. This allows connection portions to route signals through the Z-direction, enabling flexible wiring layouts that are not constrained by the two-dimensional pixel array arrangement on the first substrate.
Solution Approach 2:
The connection portion is divided into multiple segments: a first connection portion extending from the pixel, a bent portion changing direction in the thickness direction, and a second connection portion connecting to the AD conversion portion. This segmentation allows each segment to be optimized independently for its specific function while maintaining overall wiring flexibility.
2Adaptability or versatility
If circuit units are aligned with pixels using conductive vias, then electrical connection is established, but arrangement freedom is restricted
Solution Approach 1:
The bent portion extends in the thickness direction between the first and second substrates, allowing circuit units to be positioned at different lateral locations while maintaining electrical connection. This three-dimensional routing enables circuit units to be arranged independently from pixel positions, providing arrangement freedom without compromising alignment precision through the use of precise via connections at the substrate interfaces.
3Adaptability or versatility
If bent portions are positioned away from substrate vicinity, then wiring layout freedom is enhanced, but connection length increases
Solution Approach 1:
The bent portion uses smooth curved transitions to change direction between the first and second substrates, avoiding sharp angles and minimizing the increase in connection length. The curved geometry allows the bent portion to efficiently bridge the thickness direction distance while maintaining reasonable signal path length.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the degree of freedom in wiring layout, prevents impedance increases, and minimizes noise influences, enabling efficient electrical connection and image processing despite differing pixel and circuit unit arrangement periods.
Implementation Method 1
a first substrate provided with a photoelectric conversion portion configured to photoelectrically convert light and generate charge
Data Source
AI summary
An imaging element includes a first substrate provided with a photoelectric conversion portion that photoelectrically converts light and generates charge, and a readout circuit that outputs a signal based on the charge generated by the photoelectric conversion portion, a second substrate laminated on the first substrate and provided with a processing portion that processes the signal output from the readout circuit, and a connection portion provided with a bent portion bending in a portion other than the vicinity of the first substrate and the second substrate, and electrically connecting the readout circuit to the processing portion.