Stacked Solid-State Imaging Layout for Large-Area Exposure
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Solution Overview
Problem
The manufacturing process of solid-state imaging devices with stacked structures is complex and costly due to the need for separate exposure and high-precision alignment of multiple regions, which increases the complexity and cost of producing devices with areas larger than the exposure range of exposure apparatuses.
Innovation Solution
A solid-state imaging device is designed with a first substrate having a pixel circuit and a second substrate with signal processing circuits, where the signal processing circuits are arranged adjacent to each other with a spacing region, and the substrates are stacked such that the scribe regions overlap, allowing for two-dimensional arrangement and one-shot exposure, thereby simplifying the manufacturing process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If separate exposure is used for regions larger than exposure apparatus range, then device area can be increased, but manufacturing process complexity and cost increase
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional stacked structure, allowing multiple device regions to be arranged vertically rather than horizontally. This enables the device area to exceed exposure apparatus range while using single-shot exposure for each substrate, reducing manufacturing complexity.
Solution Approach 2:
The device is divided into multiple substrates (first substrate with pixel circuit, second substrate with signal processing circuits) that are exposed separately and then stacked. Each substrate can be exposed within the apparatus range, but the stacked configuration achieves overall device area larger than the exposure range.
2Area of stationary object
If separate exposure is used for multiple regions, then device area can be increased, but manufacturing cost increases
Solution Approach 1:
By stacking substrates vertically, the patent achieves large device area without requiring multiple exposure steps across a large planar area. Each substrate is exposed individually within the apparatus range, reducing the need for expensive high-precision alignment equipment and multiple photomasks.
Solution Approach 2:
The substrates are prepared and exposed separately before stacking. This preliminary separation allows each substrate to be manufactured using standard exposure processes within the apparatus range, avoiding the need for expensive large-area exposure equipment and complex simultaneous multi-region exposure.
3Area of stationary object
If high-precision alignment is used for connecting separated regions, then device area can be increased, but manufacturing process complexity increases
Solution Approach 1:
The patent uses vertical stacking to connect separate exposed regions, which simplifies alignment requirements compared to planar拼接. The alignment is performed between stacked substrates rather than between adjacent planar regions, reducing the precision requirements and complexity of the alignment process.
Solution Approach 2:
The patent introduces scribe regions as intermediary areas that facilitate alignment and connection between substrates. These scribe regions provide reference marks and bonding areas that simplify the alignment process when connecting separately exposed regions through stacking.
Data Source
AI summary
There is provided a solid-state imaging device including a first substrate having a pixel circuit including a pixel array unit formed thereon, and a second substrate having a plurality of signal processing circuits formed thereon so as to be arranged through a scribe region. The first substrate and the second substrate are stacked.