Stacked Imaging Device for Camera Module Miniaturization
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Solution Overview
Problem
Existing camera modules are not adequately miniaturized to meet current demands, as they typically separate image sensors and output interfaces, hindering compact design requirements.
Innovation Solution
An imaging device configuration where a pixel unit is on a first substrate, and image processing, encoding, and address assignment units are stacked on a second substrate, allowing for miniaturization and inclusion of additional components like output units and time synchronization functions on the second substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If image sensor and output interface are separately provided, then signal processing function is improved, but camera module size increases
Solution Approach 1:
The patent combines the image sensor and output interface into a single integrated device, where the image sensor includes both the pixel unit for capturing images and the output unit for transmitting image data. This merging eliminates the need for separate components while maintaining full signal processing functionality, thereby reducing camera module size.
Solution Approach 2:
The image sensor is designed with multi-functionality, serving both as an image capturing device and an output interface. The device can capture images through the pixel unit and simultaneously output image data through the integrated output unit, allowing one component to perform multiple functions that previously required separate devices.
2Device complexity
If pixel unit and signal processing circuit are integrated on same substrate, then device complexity is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the image sensor into distinct functional units including a pixel unit for image capture and an output unit for data transmission. These units are arranged in a specific spatial relationship on the substrate, with the output unit positioned to receive light through a predetermined opening. This segmentation allows for modular design and manufacturing while maintaining functional integration.
Solution Approach 2:
The patent utilizes the spatial dimension by arranging the output unit and pixel unit in specific positional relationships on the substrate. The output unit is positioned at a location where it can receive light through a predetermined opening, creating a three-dimensional functional arrangement that optimizes both integration and manufacturing feasibility.
Data Source
AI summary
The need for miniaturizing camera modules is to be effectively satisfied. There are provided a pixel unit, an image processing unit that processes an image signal generated by the pixel unit, an encoding unit that encodes the image signal processed by the image processing unit, and an address assignment unit that assigns an address to a compressed signal encoded by the encoding unit. The pixel unit is provided on a first substrate. The image processing unit, the encoding unit, and the address assignment unit are provided on a second substrate to be stacked on the first substrate.