3D Stacked-In-Recess SiP for Low Z-Height

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Solution Overview

Problem

System in package (SiP) devices face challenges in miniaturization to improve connectivity and align with current manufacturing trends, particularly in achieving a low-profile 3D stacked architecture with stacked dice mounted at a notch of a landed die, while maintaining efficient electrical communication and packaging parameters.

Innovation Solution

The implementation of a composite contoured recess formed by notches in landed dice, allowing a stacked die to be seated within, with through-silicon vias (TSVs) establishing electrical communication, and varying metallization layers for efficient communication between dice, enabling a lower z-height and flexible die stacking configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional 3D stacked architecture is used, then connectivity is improved, but device profile height increases

Engineering Contradiction:

ImproveconnectivityVSAvoiddevice profile height

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The stacked die is nested within a recess formed by notches in the landed dice, allowing the stacked component to be partially embedded rather than protruding. This nesting approach reduces the overall device profile height while maintaining the 3D stacked connectivity architecture, as the stacked die is housed within the recessed space of the landed dice assembly

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If die stacking is implemented to improve connectivity, then manufacturing complexity increases

Engineering Contradiction:

ImproveconnectivityVSAvoidpackaging complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The recess is pre-formed in the landed dice through notches before the stacked die is attached. This preliminary action of creating the recessed structure in advance simplifies the subsequent stacking process, as the stacked die can be directly placed into the pre-prepared recess rather than requiring complex post-assembly modifications or alignment procedures

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The structure is segmented into landed dice with notches and a separate stacked die component. This segmentation allows each component to be manufactured and prepared independently, then assembled together through the recess interface, reducing overall packaging complexity compared to monolithic structures

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables a lower z-height SiP device with efficient electrical communication and flexible die stacking, aligning with miniaturization needs and manufacturing trends, while maintaining compatibility with different die types and configurations.

Implementation Method 1

with through-silicon vias (TSVs) establishing electrical communication

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS10943792B23D stacked-in-recess system in package

Publication Date: 2021.03.09 TAHOE RES LTD

AI summary

A system in package device includes a landed first die disposed on a package substrate. The landed first die includes a notch that is contoured and that opens the backside surface of the die to a ledge. A stacked die is mounted at the ledge and the two dice are each contacted by a through-silicon via (TSV). The system in package device also includes a landed subsequent die on the package substrate and a contoured notch in the landed subsequent die and the notch in the first die form a composite contoured recess into which the stacked die is seated.