Stacked Inductor Coil Layout for High Inductance in Small Packages
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Solution Overview
Problem
The miniaturization of passive inductive components in integrated circuits poses a challenge due to their larger size, which is related to physical dimensions, necessitating high current and high inductance devices with a small form factor.
Innovation Solution
The design involves stacked packaged devices with conductor layers forming multi-turn coils, where each turn includes conductive lines from both devices, connected via external connectors and solder balls, allowing for high inductance and current density while maintaining a compact size, and optionally using magnetic filler materials to enhance inductance and Q factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the physical dimensions of inductive elements are increased to achieve high current and high inductance, then the inductance and current carrying capacity are improved, but the form factor increases and miniaturization is compromised
Solution Approach 1:
The patent transitions from planar 2D conductor traces to three-dimensional vertically stacked conductor layers. Multiple conductor layers are positioned at different heights (Z-dimension) and interconnected via conductive vias, creating multi-turn coils that achieve high inductance within a compact footprint by utilizing the vertical dimension for additional winding turns
Solution Approach 2:
The patent embeds multiple conductor layers within a single package body, with each layer nested vertically above or below others. The conductive vias penetrate through intermediate layers to connect upper and lower conductor layers, effectively nesting multiple functional elements within a compact three-dimensional structure that achieves high inductance without proportional increase in planar footprint
2Volume of moving object
If miniaturization is pursued to reduce form factor, then the compactness is improved, but the inductance and current carrying capacity deteriorate
Solution Approach 1:
By stacking conductor layers vertically and connecting them through conductive vias, the patent creates multi-turn coils in the Z-dimension. This vertical stacking allows multiple effective turns within a small planar footprint, achieving high inductance and current capacity without increasing the device's lateral dimensions
Solution Approach 2:
The patent employs composite construction with multiple conductor layers separated by dielectric materials, with conductive vias providing interlayer connections. This composite layered structure enables high current carrying capacity through distributed current paths while maintaining compact dimensions through vertical integration
3Ease of manufacture
If conventional planar inductor designs are used, then the manufacturing simplicity is maintained, but the inductance density and current handling capability are limited
Solution Approach 1:
The patent divides the inductor structure into multiple discrete conductor layers, each forming part of the overall coil. Each layer can be independently patterned and connected via vias, allowing modular fabrication that maintains manufacturing simplicity while achieving high inductance density through vertical integration of segmented conductor paths
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides inductive devices with high inductance and large current density in a small form factor, suitable for high current applications, and is simple and cost-effective to manufacture, with improved electrical characteristics.
Implementation Method 1
the first set of conductive lines are electrically connected to the second set of conductive lines to define a coil having multiple turns
Implementation Method 2
optionally using magnetic filler materials to enhance inductance and Q factor
Data Source
AI summary
An inductive device includes multiple packaged devices, each including a body and a conductor layer within the body and a set of external connectors. The conductor layer of a packaged device includes a set of conductive lines electrically connected to the set of external connectors of the packaged device. Conductive lines of two packaged devices of the inductive device are at an angle relative to one another. External connectors of the packaged devices are coupled to one another to electrically connect the sets of conductive lines to define one or more coils, each coil having multiple turns and each turn including a conductive line of each packaged device.