Stacked Inductor Devices with Core Gaps for High Power Density
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Solution Overview
Problem
Conventional inductor components in switching power supply circuits are unsuitable for compact and efficient high current output power supply circuits due to their planar topology, which limits their ability to maintain output voltage within desired ranges and increases losses.
Innovation Solution
The development of an N-phase inductor device with magnetically permeable core material and strategically placed gaps to control magnetic flux and coupling, allowing for reduced inductance and magnetic saturation, enabling efficient power conversion with high power density and reduced losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional planar inductor components are used in switching power supply circuits, then the circuit board can be populated with multiple components via horizontal power flow, but the power supply circuit cannot achieve compact design and high current output efficiency
Solution Approach 1:
The patent transitions from conventional planar (2D) inductor layouts to a three-dimensional stacked topology where inductors are arranged vertically across multiple layers. This dimensional change enables compact power supply circuit design by utilizing the vertical space above the circuit board, thereby reducing the horizontal footprint while maintaining or improving power delivery efficiency and reducing losses.
Solution Approach 2:
The patent implements a nested structure where inductors are stacked vertically in multiple layers, with each inductor phase positioned above another. This nesting approach allows multiple inductor phases to occupy the same horizontal footprint area, achieving compact design while enabling high current output through the combined capacity of stacked phases.
2Power
If wire is wound into a coil of multiple turns to increase magnetic flux and inductance, then the inductor component achieves higher inductance, but the planar topology limits compact design and increases losses
Solution Approach 1:
Instead of increasing inductance through multiple wire turns in a planar configuration, the patent achieves high inductance by stacking inductor phases vertically in three dimensions. This approach provides the required magnetic flux and inductance values while maintaining a compact horizontal footprint, as the vertical stacking utilizes unused space above the circuit board.
3Ease of manufacture
If conventional planar power supply topology is used, then components can be coupled via circuit traces on the planar surface, but it is difficult to create a compact and efficient high current output power supply circuit
Solution Approach 1:
The patent maintains ease of manufacture by using standard circuit board fabrication techniques for coupling components via traces on the planar surface, while simultaneously improving power delivery efficiency by transitioning to a three-dimensional stacked topology for the inductors. This hybrid approach combines the manufacturing simplicity of planar circuits with the space-efficient and high-performance benefits of vertical stacking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high power density close to the digital load, reduces losses in the Power Delivery Network, improves transient performance, and minimizes copper losses, while allowing for compact design and efficient power conversion.
Implementation Method 1
The core material is operable to confine first magnetic flux generated from current flowing through the first electrically conductive path
Implementation Method 2
The fabricator further fabricates the core material to include a gap, which has a different magnetic permeability than the core material. The gap serves to control magnitude flux in the core material
Implementation Method 3
first magnetic flux generated from current flowing through the first electrically conductive path
Data Source
AI summary
According to one configuration, an inductor device comprises core material and at least a first electrically conductive path. The core material is fabricated from magnetically permeable material. The first electrically conductive path extends axially through the core material from a proximal end of the inductor device to a distal end of the inductor device. The core material is operable to confine first magnetic flux generated from first current flowing through the first electrically conductive path. The inductor device further includes a gap in the core material. The gap (gas or solid material) has a different magnetic permeability than the core material. Inclusion of the gap in the core material provides a way to tune an inductance of the inductor device and increase a magnetic saturation level of the inductor device. The core material includes any number of electrically conductive paths and corresponding gaps.