Stacked Inductor Filter Layout to Reduce Electromagnetic Coupling
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Solution Overview
Problem
Existing electronic components suffer from significant loss due to electromagnetic coupling between inductors, which affects their performance and efficiency.
Innovation Solution
The electronic component is designed with a specific configuration of conductor layers and inductors, where the third conductor layer is positioned at an identical vertical position to parts of the first and second conductor layers, and the number of layers in the first and second conductor layers is greater than that of the third, minimizing electromagnetic coupling by offsetting central axes and creating gaps between conductor patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple inductors are disposed side by side in a planar configuration, then the device complexity is reduced and manufacturing is simplified, but electromagnetic coupling between inductors increases causing significant loss
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration where inductors are positioned on different conductor layers at different vertical positions. This spatial separation in the vertical dimension reduces electromagnetic coupling between inductors while maintaining a compact overall structure, thereby reducing energy loss without significantly increasing device complexity.
Solution Approach 2:
The patent embeds multiple conductor layers containing inductors within a stacked insulating layer structure. The inductors are nested within the multi-layer substrate, with each inductor on a specific conductor layer surrounded by insulating layers. This nesting approach allows close integration while maintaining electrical isolation and reducing electromagnetic interference between adjacent inductors.
2Area of stationary object
If inductors are positioned close together to save space, then the area occupied is reduced, but electromagnetic coupling between inductors increases causing loss
Solution Approach 1:
The patent utilizes the vertical dimension by stacking conductor layers containing inductors at different heights. This allows inductors to be closely positioned in the planar view while being separated vertically, achieving compact area utilization while minimizing electromagnetic coupling through the insulating layers between conductor layers.
Solution Approach 2:
The patent introduces insulating layers as intermediary structures between conductor layers containing inductors. These insulating layers act as electromagnetic shields and physical separators, allowing inductors to be positioned close together in the planar direction while the insulating material between layers reduces electromagnetic coupling and prevents direct interference.
3Loss of energy
If the number of conductor layers is increased to reduce coupling, then the manufacturing precision requirements increase, but electromagnetic coupling loss is reduced
Solution Approach 1:
The patent employs multiple conductor layers stacked in the vertical direction, each containing inductors. By distributing inductors across different vertical levels rather than placing them adjacent in the same plane, the design reduces electromagnetic coupling while the standardized layering process maintains manageable manufacturing precision requirements through conventional multi-layer PCB fabrication techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces loss by minimizing electromagnetic coupling between inductors, enhancing the component's performance and efficiency.
Implementation Method 1
a first filter circuit including at least one or more conductor layers of the plurality of conductor layers and configured to process a signal in a first frequency band, and a second filter circuit including at least one or more conductor layers of the plurality of conductor layers and configured to process a signal in a second frequency band higher than the first frequency band
Implementation Method 2
the first series resonant circuit is disposed between the second input/output terminal and a ground, and the second series resonant circuit is disposed between the third input/output terminal and the ground
Data Source
AI summary
An electronic component includes first and second filter circuits. The first filter circuit has a first inductor on a first conductor layer. The second filter circuit has a second inductor on a second conductor layer and a third inductor on a third conductor layer. These inductors are aligned side by side in a direction orthogonal to the stacking direction of the conductor layers. The third conductor layer is at the same vertical position as parts of the first and second conductor layers. The first and second conductor layers each have more layers than the third conductor layer.