Stacked Inductor with Helical Coil for Miniaturization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The limitation in downsizing inductors using winding coils is about 1.6 mm×1.6 mm due to the thickness of the winding, which hinders the increase of inductance, necessitating a solution for miniaturization while maintaining or enhancing inductance.
Innovation Solution
A stacked structure inductor design with a substrate and sequentially stacked structural bodies, featuring a helical coil configuration where the first wiring is at the lowermost layer and multiple second wirings are stacked on top, connected in series through via wirings, with an insulation film covering the structure except for specific connection portions, allowing for miniaturization without compromising inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the inductor is downsized to below 1.6 mm×1.6 mm, then the planar area is reduced for miniaturization, but the ratio of winding volume to total area decreases, hindering inductance increase
Solution Approach 1:
The patent transitions from a planar winding structure to a three-dimensional stacked structure. Multiple wirings are arranged in different layers (first wiring in lowermost layer, second wirings in intermediate layers, third wiring in uppermost layer) and connected via via holes, effectively utilizing the vertical dimension to increase winding volume within a reduced planar footprint, thereby resolving the contradiction between miniaturization and inductance maintenance
Solution Approach 2:
The patent implements a nested layered structure where multiple wirings are stacked within each other in the vertical direction. The first wiring is positioned in the lowermost layer, second wirings are stacked in intermediate layers with insulation films, and the third wiring is in the uppermost layer, creating a compact nested configuration that maximizes winding density within the limited space
2Quantity of substance
If multiple stacked structural bodies are used to increase inductance, then the number of layers increases for higher inductance, but the device complexity increases
Solution Approach 1:
The substrate serves multiple functions simultaneously: it provides mechanical support for the stacked structural bodies, acts as an insulation layer between layers, and facilitates electrical connections through via holes. This multi-functionality reduces the need for additional specialized components, thereby managing device complexity while enabling the stacked configuration for increased inductance
Solution Approach 2:
The patent combines multiple functional elements into integrated structures. The insulation films are formed between adjacent wirings in the stacking direction, and via holes provide both mechanical alignment and electrical connectivity. This merging of functions into unified structures reduces overall device complexity despite the increased number of stacked layers
Data Source
AI summary
An inductor includes a stacked structure. The stacked structure includes a substrate, a first structural body stacked on a lower surface of the substrate, and second structural bodies sequentially stacked on an upper surface of the substrate. A through hole extends through the stacked structure in a thickness direction. An insulation film covers the stacked structure. The first structural body includes a first insulating layer stacked on the lower surface of the substrate, and a first wiring stacked on a lower surface of the first insulating layer. The second structural bodies include second insulating layers and second wirings. The first wiring and the second wirings are connected in series to one another to form a helical coil. The substrate has a thickness greater than that of the first insulating layer and the second insulating layers.