Stacked Inductor Layout for Smaller Footprint and Lower Interference
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Solution Overview
Problem
Conventional 8-shaped inductors occupy larger areas, which hinders the miniaturization of electronic devices and does not effectively reduce signal interference between wires.
Innovation Solution
The inductor device employs a stacked structure with sub-wires on different layers, where the first and second sub-wires are wound in opposite directions, reducing the overall area and minimizing signal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional 8-shaped inductor structure is used, then signal interference between wires is reduced, but the occupied area increases
Solution Approach 1:
The patent transitions from a planar 8-shaped inductor to a three-dimensional stacked structure with sub-wires arranged on multiple layers (first layer, second layer, third layer). This vertical stacking in the Z-dimension reduces the horizontal footprint while maintaining the interference-reducing topology through alternating current directions in different layers
Solution Approach 2:
The inductor is segmented into multiple sub-wires (first sub-wire, second sub-wire, third sub-wire, fourth sub-wire) distributed across different layers. Each sub-wire carries current in a specific direction, and their segmented arrangement in space allows for reduced mutual interference while compact packaging
2Area of stationary object
If stacked structure is adopted, then occupied area is reduced, but device complexity increases
Solution Approach 1:
The patent implements a nested hierarchical structure where sub-wires are organized within layers, layers are stacked vertically, and connection elements interconnect across layers. This nested arrangement achieves compact three-dimensional integration while providing a systematic framework that manages complexity through structured organization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The stacked structure reduces the inductor's area by 35.9% compared to conventional designs and efficiently decreases signal interference while maintaining similar inductance and quality factor performance.
Implementation Method 1
The first sub-wire and the second sub-wire are located on different layers. The third sub-wire and the fourth sub-wire are located on different layers
Data Source
AI summary
An inductor device includes a first wire and a second wire. The first wire includes a first sub-wire and a second sub-wire. The first sub-wire is disposed in a first area. The second sub-wire is disposed in a second area, and the first sub-wire and the second sub-wire are located on different layers. The second wire includes a third sub-wire and a fourth sub-wire. The third sub-wire is disposed in the second area, and located below the second sub-wire. The fourth sub-wire is disposed in the first area, the third sub-wire and the fourth sub-wire are located on different layers, and the fourth sub-wire is located above the first sub-wire.