Stacked Inductor with Magnetic Encapsulation
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Solution Overview
Problem
Conventional inductors face challenges with high parasitic resistance due to limited contact area between the internal coil part and external electrodes, which affects their performance.
Innovation Solution
The development of an inductor design featuring a coil substrate with a laminate structure and encapsulation material containing magnetic material, where the coil substrate includes conductive tracks connected in series to form a helical coil, and external electrodes are connected to the electrode terminals, increasing the contact area and reducing resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the internal coil part is connected to external electrodes through limited contact area, then the inductor size can be reduced, but parasitic resistance increases
Solution Approach 1:
The patent transitions from a planar connection structure to a three-dimensional stacked structure. Multiple coil substrates are stacked vertically with connection parts extending to side surfaces, enabling external electrodes to contact the coil part from multiple spatial dimensions (top, bottom, and side surfaces), thereby increasing contact area without increasing the horizontal footprint of the inductor.
Solution Approach 2:
The patent implements a nested structure where connection parts are embedded within the stacked coil substrates. The connection parts are positioned between layers of coil substrates and extend to side surfaces, creating a nested arrangement that maximizes contact area utilization within the compact inductor volume.
2Reliability
If the contact area between internal coil part and external electrodes is increased, then parasitic resistance decreases, but the device complexity increases
Solution Approach 1:
The patent divides the inductor into segmented coil substrates stacked in layers, with connection parts distributed across different levels. This segmentation allows the connection area to be distributed across multiple interfaces rather than concentrated in a single complex structure, simplifying the overall design while increasing total contact area.
Solution Approach 2:
The side surfaces of the stacked coil substrates serve multiple functions: they provide mechanical support for stacking, enable electrical connection between layers, and expose connection parts for external electrode contact. This multi-functionality reduces the need for separate dedicated connection structures, thereby reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces parasitic resistance and enhances the inductance of the inductor, improving its performance and reliability.
Implementation Method 1
an encapsulation material containing a magnetic material and selectively covering the coil substrate
Data Source
AI summary
An inductor includes a coil substrate, an encapsulation material containing a magnetic material and selectively covering the coil substrate, and first and second external electrodes formed on the exterior of the encapsulation material. The coil substrate includes a laminate of stacked structures each including a conductive track and first and second connection parts on opposite sides of the conductive track in a single wiring layer. The conductive tracks are connected in series to form a helical coil. The first connection parts are connected by a first via to form a first electrode terminal connected to a first end of the helical coil. The second connection parts are connected by a second via to form a second electrode terminal connected to a second end of the helical coil. The first and second external electrodes are connected to the first and second electrode terminals, respectively.