Stacked Inductor Package Layout for Compact DC/DC Converters
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Solution Overview
Problem
Conventional DC/DC converter components require a significant mounting area due to the separate installation of inductor components on the motherboard, which is not efficient in terms of space utilization.
Innovation Solution
A DC/DC converter component design where the inductor component, with a magnetic layer and multiple inductor wiring lines, is mounted directly on the package substrate, allowing for a reduced mounting area by eliminating the need for additional space on the motherboard.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the inductor component is made larger to acquire desired inductance, then the inductance value is improved, but the mounting area increases
Solution Approach 1:
The patent transitions the inductor component from a planar layout to a three-dimensional stacked configuration. The inductor wiring lines are arranged in multiple layers (first inductor wiring line in a first layer, second inductor wiring line in a second layer), utilizing the vertical dimension to increase inductance without expanding the footprint on the package substrate. This dimensional transition allows the inductor to achieve desired inductance values while maintaining a compact mounting area.
Solution Approach 2:
The patent implements a nested structure where the second inductor wiring line is positioned within the vertical space above the first inductor wiring line. The inductor components are stacked one above another in the thickness direction, with the lower inductor component containing the first wiring line and the upper inductor component containing the second wiring line. This nesting approach maximizes the use of vertical space to increase inductance while minimizing the horizontal mounting area.
2Reliability
If the inductor component is mounted separately on the motherboard, then the inductance function is achieved, but the device complexity increases
Solution Approach 1:
The patent merges the inductor component with the package substrate by mounting the inductor component directly on the package substrate rather than separately on the motherboard. The inductor component is integrated into the existing package substrate structure, eliminating the need for separate mounting processes and reducing the overall device complexity. This integration maintains the inductance function while simplifying the mounting structure.
3Area of stationary object
If the inductor component thickness is reduced to 0.25mm or less, then the mounting area is reduced, but the manufacturing precision requirements increase
Solution Approach 1:
The patent segments the inductor component into multiple thin layers, with each layer containing specific wiring lines. The inductor component is divided into a first inductor component with the first inductor wiring line and a second inductor component with the second inductor wiring line, stacked in the thickness direction. This segmentation allows the overall thickness to be controlled at 0.25mm or less while maintaining the required inductance through the multi-layer configuration. Each layer can be manufactured with standard precision, avoiding the need for extremely high precision in a single thick component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the overall mounting area required, increases the flexibility in arranging semiconductor integrated circuits, and allows for various inductance values based on usage conditions, enhancing the operating efficiency of the DC/DC converter.
Implementation Method 1
an inductor component (10); a semiconductor integrated circuit (310) including a switch circuit (320) connected to the inductor component (10)... The inductor component includes an element body (BD) including a magnetic layer (50) formed of a magnetic material
Data Source
AI summary
A DC/DC converter component has a reduced mounting area and includes an inductor component; a semiconductor integrated circuit including a switch circuit connected to the inductor component, and a control circuit that controls the switch circuit; and a package substrate, to which the semiconductor integrated circuit is mounted, having a mounting face that opposes an other substrate when the package substrate is mounted to the other substrate. The inductor component includes an element body, and a plurality of inductor wiring lines, each extending in the element body and in parallel with a main face of the element body. A value of inductance of a second inductor wiring line is 10% or more greater than a value of inductance of a first inductor wiring line. The inductor component has a dimension equal to or less than 0.25 millimeters in a thickness direction, and is mounted to the package substrate.