Stacked Inductor Structure for Higher Inductance in Smaller Packages
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Solution Overview
Problem
Conventional inductors in semiconductor packages face challenges in achieving desired inductance values and Q factors while meeting miniaturization, thinness, and cost efficiency, with existing manufacturing processes being lengthy and prone to defects.
Innovation Solution
A modular inductor structure comprising a bottom, intermediate, and top element, each manufactured separately, allowing for flexible assembly and stacking to achieve desired inductance and Q values, with conductive structures and magnetically permeable bodies forming an inductance coil.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the area or volume of the coil-type inductor is increased to increase the inductance value, then the inductance value is improved, but the package size and weight increase, failing to meet miniaturization requirements
Solution Approach 1:
The inductor is divided into multiple separate layers (first inductor layer, second inductor layer, third inductor layer) that are stacked vertically. Each layer contributes to the total inductance, allowing the inductance value to be increased without increasing the planar area. The segmentation enables three-dimensional utilization of space, resolving the contradiction between inductance value and package volume.
Solution Approach 2:
The patent transitions from a two-dimensional planar coil structure to a three-dimensional stacked structure by adding the vertical dimension. Multiple inductor layers are arranged at different heights and connected via conductive vias, effectively increasing inductance through vertical stacking rather than horizontal expansion, thus meeting miniaturization requirements.
2Adaptability or versatility
If the semiconductor package process is used to manufacture inductors, then integration is improved, but the manufacturing time increases and defects require scrapping or remanufacturing
Solution Approach 1:
The manufacturing process is segmented into independent stages: substrate preparation with first inductor layer, intermediate substrate preparation with second inductor layer, and top substrate preparation with third inductor layer. Each substrate can be manufactured and tested independently, allowing parallel processing and reducing overall manufacturing time. Defects in one layer do not necessitate scrapping the entire package.
Solution Approach 2:
Multiple inductor layers are prepared in advance on separate substrates before final assembly. This preliminary preparation allows for independent optimization and testing of each layer, and enables parallel manufacturing processes. The pre-prepared layers are then stacked and connected, significantly reducing the final assembly time and allowing defect isolation.
3Volume of moving object
If thin film inductors are used to meet miniaturization requirements, then the package size is reduced, but the inductance value becomes too small to meet requirements
Solution Approach 1:
Multiple thin film inductor layers are merged into a single stacked structure to achieve the required total inductance value. Each layer can be manufactured as a thin film structure meeting miniaturization requirements, but their combined inductance through vertical stacking achieves the target inductance value, resolving the contradiction between size reduction and inductance maintenance.
Solution Approach 2:
The inductor structure uses composite construction with multiple inductor layers made of conductive materials, magnetic cores, and insulating layers stacked together. This composite structure allows each thin film layer to maintain small dimensions while the combination achieves the required inductance value through additive inductance contribution from multiple layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular design enables efficient production of inductors with customizable inductance and Q values, reducing manufacturing time and cost while meeting miniaturization requirements.
Implementation Method 1
at least one magnetically permeable body, wherein the second inductance circuit portion is electrically connected to the first inductance circuit portion
Data Source
AI summary
An inductor structure is provided and includes a bottom element, at least one intermediate element and a top element. The bottom element includes a first inductance circuit portion. The intermediate element is stacked on the bottom element and includes at least one second inductance circuit portion and at least one magnetically permeable body. The top element is stacked on the intermediate element and includes a third inductance circuit portion. The first inductance circuit portion, the second inductance circuit portion and the third inductance circuit portion constitute an inductance coil, and the magnetically permeable body is located within the inductance coil and is free from being electrically connected to the inductance coil. A method of manufacturing the inductor structure is further provided.