Stacked Insulator Passive Components for Wireless Device Miniaturization

The patent transitions from planar passive components to three-dimensional stacked insulator structures. Multiple insulators are stacked vertically with conductive elements extending through them, creating vertical vias and coil shapes that utilize the third dimension (height) to reduce the horizontal footprint of the passive components while maintaining their electrical functionality.

The patent embeds conductive elements, vias, and coil structures within and through the stacked insulators. The conductive layers are nested between insulator layers, and vias pass through multiple insulators, creating a compact nested configuration where functional elements are integrated within the insulator stack rather than being separate components.

The patent divides the passive component into multiple discrete insulator segments stacked together, with conductive elements distributed across different levels. This segmentation allows for modular construction where each insulator layer can be prepared and positioned separately, then assembled into the final stacked configuration, managing complexity through systematic division.

The stacked insulator structure serves multiple functions simultaneously: providing electrical insulation, forming mechanical support, creating vertical vias for connectivity, and enabling coil shape formation for inductors. The conductive elements embedded within the insulators perform both structural and electrical functions, reducing the need for separate components.