Stacked Interface Switching Circuit for Heat Dissipation
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Solution Overview
Problem
Traditional terminal devices have limited and incompatible output interfaces, leading to resource wastage and restricted functionality when attempting to connect with other devices for data transmission or extension.
Innovation Solution
An interface switching circuit is implemented with a first circuit board featuring a Type-C interface, protocol configuration chip, HUB module, video interface module, and network interface module, and a second circuit board with a power module, allowing for multiple data transmission channels through USB, video, and network interfaces, with components connected in a stacked manner for enhanced heat dissipation and compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple interface modules are integrated on a single circuit board, then interface versatility is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The circuit board is divided into a first circuit board for data transmission modules and a second circuit board for power modules, physically separating heat-generating components to improve heat dissipation while maintaining interface versatility through the HUB module's multiple output interfaces
2Adaptability or versatility
If multiple interface modules are integrated on a single circuit board, then interface versatility is improved, but device size increases
Solution Approach 1:
The patent transitions from a single-plane circuit board layout to a stacked three-dimensional architecture with first and second circuit boards arranged vertically, reducing the horizontal footprint and overall device size while accommodating multiple interface modules through spatial layering
3Device complexity
If power module is integrated with data transmission modules, then circuit complexity is reduced, but heat dissipation performance deteriorates
Solution Approach 1:
The power module is segmented and placed on a separate second circuit board from the data transmission modules on the first circuit board, reducing thermal interference and improving heat dissipation while maintaining electrical connectivity through standardized interfaces
4Device complexity
If traditional interface configurations are used, then device simplicity is maintained, but resource utilization deteriorates
Solution Approach 1:
The HUB module provides multiple USB interfaces and supports various connection types, enabling a single device to perform multiple functions including data transmission, video output, and device charging, thereby improving resource utilization while maintaining relative device simplicity through standardized modular components
Data Source
AI summary
Provided is an interface switching circuit which is arranged on a first circuit board and a second circuit board. The first circuit board is provided with a Type-C interface, a protocol configuration chip, a HUB module, a video interface module, a USB interface module, and a network interface module. The second circuit board is provided with a power module. The Type-C interface is connected to the HUB module, the video interface module, and the protocol configuration chip respectively. The HUB module is connected to the USB interface module, the protocol configuration chip and the network interface module respectively, and the video interface module is connected to the protocol configuration chip. The first circuit board is electrically connected to the second circuit board, so that the power module is electrically connected to the Type-C interface, the protocol configuration chip, the HUB module and the network interface module.