Stacked Interposer Leadframes for Thermal Management

The patent transitions from planar heat dissipation to three-dimensional heat management by stacking leadframes vertically. Multiple leadframes are stacked with thermal vias extending through each layer, creating a vertical heat conduction path that resolves the heat dissipation challenge inherent in high-density stacking.

The patent introduces thermal vias as intermediary structures between stacked leadframes. These vias act as thermal conduits that transfer heat from upper die layers through intermediate leadframes to lower layers and ultimately to the substrate, enabling effective heat management in stacked configurations.

The patent resolves the conflict between compact size and heat dissipation by utilizing the vertical dimension. Heat is conducted upward through stacked leadframes and thermal vias rather than requiring lateral expansion, allowing effective heat management within a minimized package footprint.

The patent implements nested structures where multiple leadframes are stacked vertically with thermal vias embedded within each layer. This nested arrangement maximizes heat dissipation pathways within the compact volume by utilizing the internal vertical space rather than requiring external expansion.

The patent merges multiple leadframes into a single stacked assembly with integrated thermal vias. This consolidation provides both electrical interconnects and thermal management pathways through unified vertical structures, reducing the complexity that would otherwise arise from separate interconnect and heat management systems.

The stacked leadframe structure serves multiple functions simultaneously: it provides electrical interconnects between stacked die, mechanical support for each layer, and thermal conduction pathways through the vertical stack. This multi-functionality reduces overall system complexity while enabling high device integration.