Stacked Inverter PCB Layout for EMC Noise Isolation
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Solution Overview
Problem
Conventional inverter apparatuses lack effective integration of EMC filters to block electromagnetic noise propagation from the output terminal to the input terminal, necessitating a solution that incorporates noise reduction within the device.
Innovation Solution
The inverter apparatus incorporates an EMC filter substrate stacked on the main circuit substrate, with a control substrate facing the front panel, and includes an input terminal on the EMC filter substrate and an output terminal on the main circuit substrate, ensuring noise reduction by inserting the EMC filter between the control and main circuit substrates and utilizing an insulation member for additional noise isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If EMC filter is externally attached to inverter apparatus, then noise reduction is achieved, but device complexity and installation space increase
Solution Approach 1:
The patent merges the EMC filter with the main circuit substrate by stacking the filter substrate directly on the substrate, integrating two previously separate components (inverter apparatus and EMC filter) into a single unified structure. This eliminates the need for external attachment while maintaining noise reduction functionality.
Solution Approach 2:
The EMC filter substrate is nested within the inverter apparatus structure by stacking it on the main circuit substrate. The filter becomes an integrated layer within the existing device architecture rather than an external addition, reducing overall device complexity.
2Object-affected harmful factors
If EMC filter substrate is stacked on main circuit substrate, then noise propagation is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the inverter apparatus into distinct functional substrates (main circuit substrate and EMC filter substrate) that are stacked separately. This segmentation allows each substrate to be manufactured and tested independently before assembly, reducing the overall manufacturing precision requirements compared to creating a single integrated component.
Solution Approach 2:
The patent introduces an insulation member as an intermediary component between the main circuit substrate and EMC filter substrate. This mediator facilitates precise alignment and electrical isolation during stacking, reducing the direct precision requirements between the two main substrates while ensuring proper noise filtering functionality.
3Adaptability or versatility
If control substrate is stacked on EMC filter substrate, then device integration is improved, but accessibility for maintenance may be reduced
Solution Approach 1:
The patent creates a dynamic, modular stacked substrate structure where layers can be independently accessed and maintained. The control substrate, EMC filter substrate, and main circuit substrate are arranged in a flexible stack that allows for selective access to different components based on maintenance requirements, balancing integration with operational accessibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively blocks electromagnetic noise propagation from the output terminal to the input terminal, enhancing noise reduction while maintaining accessibility and minimizing size and cost increases.
Implementation Method 1
an EMC filter substrate stacked on a surface of the main circuit substrate facing the front panel, and configured to reduce propagation of noise
Data Source
Figure 1
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AI summary
An inverter apparatus 1 according to the present disclosure has a front panel 65, and includes: a main circuit substrate 10, which converts power; an EMC filter substrate 30, which is stacked on the surface of the main circuit substrate 10 facing the front panel 65 and which reduces propagation of noise; and a control substrate 50, which is stacked on the surface of the EMC filter substrate 30 facing the front panel 65 and which controls the main circuit substrate. The EMC filter substrate 30 includes an input terminal 31, through which the power is input into the inverter apparatus 1. The main circuit substrate 10 includes an output terminal 11, through which the power is output from the inverter apparatus 1.