Stacked Molded Isolation Transformer With Reduced Air Gaps
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Solution Overview
Problem
Integrated magnetic circuits in electronic devices face challenges such as increased package height, trapped air bubbles, and reduced reliability due to fringing effects in laminate planar transformers, while on-chip integrated transformers suffer from low efficiency and higher costs compared to laminate-based solutions.
Innovation Solution
A low-profile stacked integrated transformer structure is achieved using substrates with patterned conductive features and molded magnetic materials, magnetically coupled through non-conductive adhesive layers within a non-magnetic molded package, eliminating the need for external magnetic sheets and reducing air gaps between windings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If laminate planar transformer with magnetic sheets is used, then integration is achieved, but package height increases and air bubbles are trapped
Solution Approach 1:
The patent combines the magnetic core and windings into a single integrated transformer component, eliminating the need for separate magnetic sheets and reducing the number of assembly steps. This merging approach maintains integration benefits while reducing package height by eliminating the tall stack structure of separate layers.
Solution Approach 2:
The patent transitions from a planar laminate structure to a three-dimensional stacked configuration where the magnetic core completely surrounds the windings. This dimensional change allows for more efficient space utilization and reduces the vertical height requirement compared to traditional laminate approaches.
2Device complexity
If laminate planar transformer is used, then integration is achieved, but fringing effects cause ac winding loss and reduced reliability
Solution Approach 1:
The patent applies different material properties to different regions of the transformer. The magnetic core material is specifically selected and positioned to provide high permeability where needed, while the winding regions are optimized for electrical performance. This local optimization eliminates fringing effects by ensuring proper magnetic coupling throughout the structure.
Solution Approach 2:
The patent uses a composite structure combining magnetic core material with non-magnetic support structures and insulation materials. This composite approach allows for optimized magnetic pathways that eliminate fringing effects while maintaining structural integrity and electrical isolation.
3Reliability
If on-chip integrated transformer is used, then isolation is qualified and integration is simple, but efficiency is low and cost is higher
Solution Approach 1:
The patent optimizes key parameters including the magnetic core permeability, winding configuration, and core-to-winding spacing to maximize transformer efficiency. By carefully selecting and adjusting these parameters, the patent achieves high efficiency while maintaining the isolation qualifications required for medical applications.
Solution Approach 2:
The patent employs a dynamic design approach where the transformer structure can be adjusted or optimized for different operating conditions. This allows the transformer to maintain high efficiency across varying load conditions while preserving the reinforced isolation characteristics.
4Loss of energy
If floating toroid core is used, then efficiency is good, but packaging difficulties increase and device dimensions increase
Solution Approach 1:
The patent merges the toroid core structure with the winding assembly into a single integrated unit, eliminating the need for separate floating core components. This integration simplifies packaging by reducing the number of discrete parts while maintaining the high efficiency benefits of the toroid configuration.
Solution Approach 2:
The patent implements a nested configuration where the windings are positioned within the toroid core structure, and the entire assembly is enclosed within a compact package. This nesting approach minimizes device dimensions by efficiently utilizing three-dimensional space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances transformer efficiency, reduces device height, mitigates packaging issues, and provides cost advantages by enabling tighter integration of magnetic circuitry with improved isolation and reduced partial discharge losses.
Implementation Method 1
The adhesive layer bonds the first substrate to the second substrate
Implementation Method 2
a first molded magnetic material that encloses a portion of the first patterned conductive feature... a second molded magnetic material that encloses a portion of the second patterned conductive feature
Implementation Method 3
a first patterned conductive feature with multiple turns that form a first winding... a second patterned conductive feature with multiple turns that form a second winding... to magnetically couple the first and second windings
Data Source
AI summary
An electronic device with an integrated transformer including a first substrate having a first patterned conductive feature with multiple turns that form a first winding, and a first molded magnetic material that encloses a portion of the first patterned conductive feature, and an adhesive layer on a side of the first substrate. The transformer also includes a second substrate having a second patterned conductive feature with multiple turns that form a second winding, and a second molded magnetic material that encloses a portion of the second patterned conductive feature, the second substrate extending on the adhesive layer to magnetically couple the first and second windings. The electronic device includes a package structure that encloses the first and second substrates.