Stacked IT Enclosure Thermal Management
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Solution Overview
Problem
Existing mobile information technology systems face challenges in achieving high computing density and efficient infrastructure resource allocation, particularly in terms of power consumption and cooling, due to the complexity and space constraints of conventional data center solutions.
Innovation Solution
A system and method that configures information technology systems by separating processing and infrastructure subsystems into distinct shipping containers, with the processing subsystem housed in one container and the infrastructure subsystem in another, utilizing active and passive thermal management to optimize airflow and reduce footprint, while allowing for flexible and efficient thermal and power infrastructure allocation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If information handling systems are concentrated in a single data center room with dedicated cooling and power equipment, then reliable operation is ensured, but infrastructure cost and complexity increase
Solution Approach 1:
The system is divided into multiple modular enclosures (first enclosure, second enclosure, third enclosure) that can be independently deployed. Each enclosure contains integrated power and cooling infrastructure, allowing the system to be segmented into manageable units that maintain reliability without requiring a single complex centralized infrastructure.
Solution Approach 2:
The patent extracts the cooling and power infrastructure from the traditional centralized data center model and embeds it within individual enclosure units. This allows each enclosure to operate independently with its own infrastructure, reducing the complexity of centralized systems while maintaining operational reliability.
2Adaptability or versatility
If cooling systems are purchased with excess capacity to accommodate growth, then future expansion is enabled, but initial infrastructure cost increases
Solution Approach 1:
The modular enclosure design allows the system to dynamically adapt to growth requirements. Additional enclosures can be added as computing capacity needs increase, allowing the infrastructure to scale proportionally with actual demands rather than requiring upfront over-provisioning of cooling and power capacity.
Solution Approach 2:
The system enables expansion by adding enclosures in a vertical or horizontal dimension rather than requiring increased capacity within a single enclosure. This allows scalable growth by simply adding more modular units with their own integrated infrastructure.
3Adaptability or versatility
If data center rooms are built with unused space for future systems, then maneuvering room is available, but space utilization efficiency decreases
Solution Approach 1:
Instead of building a large room with unused space, the system segments the data center into multiple compact enclosures. Each enclosure is self-contained with appropriate space utilization, and additional enclosures can be added as needed without requiring large unused spaces within individual rooms.
4Productivity
If infrastructure equipment is distributed to separate enclosures, then computing density increases, but thermal management complexity increases
Solution Approach 1:
The patent merges the thermal management functions of multiple enclosures by connecting them through a common cooling infrastructure. The first enclosure, second enclosure, and third enclosure are thermally integrated, allowing heat from high-density computing equipment to be efficiently managed across the distributed system without proportionally increasing management complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves higher computing density with improved infrastructure resource allocation, reducing the complexity and cost of data center setup by allowing for efficient thermal management and flexible scaling of infrastructure to meet growing information processing needs.
Implementation Method 1
an air mover in a second shipping container that outputs treated air to the intake portion and receives exhaust from the exhaust portion
Data Source
AI summary
An information technology enclosure has a processing subsystem and infrastructure subsystem in separate shipping containers that cooperate to process information. The processing subsystem has increased information processing density by concentrating information handling systems in a first processing shipping container that is supported with infrastructure equipment in a second infrastructure shipping container. In one embodiment, the shipping containers are arranged in a stacked configuration so that cooled air and exhausted air are exchanged through aligned vents formed in the ceiling and floor of stacked shipping containers.