Stacked IVR Package Layout for Smaller Board Area and Lower Noise
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Solution Overview
Problem
Existing semiconductor packages with voltage regulators are bulky due to separate placement of inductors and capacitors on circuit boards, making them difficult and costly to miniaturize.
Innovation Solution
An integrated voltage regulator (IVR) package is developed with a stacked structure that includes one or more inductors and capacitors integrated with the IVR chip on a package substrate, using an intermediate substrate with vias to minimize size and improve noise reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If inductors and capacitors are arranged separately on circuit boards with voltage regulators, then the voltage regulator can be designed for specific systems, but the size of the electronic device increases
Solution Approach 1:
The patent combines the voltage regulator chip, inductors, and capacitors into a single integrated package substrate. The inductors and capacitors are formed directly on the package substrate using conductive patterns and dielectric layers, eliminating the need for separate discrete components on the circuit board. This merging of components resolves the contradiction by maintaining system-specific voltage regulation capabilities while dramatically reducing the total board area occupied.
Solution Approach 2:
The package substrate serves multiple functions simultaneously: it acts as the circuit board for the voltage regulator, provides the structural platform for forming inductors and capacitors, and integrates all three components (voltage regulator, inductors, capacitors) into a single functional unit. This multi-functionality allows the same substrate to fulfill roles that traditionally required separate components, thereby reducing board area while maintaining adaptability.
2Adaptability or versatility
If voltage regulators are fabricated separately and arranged on circuit boards, then specific VR designs can be implemented, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges previously separate fabrication processes into a unified approach. The voltage regulator chip, inductors, and capacitors are all fabricated and integrated on a single package substrate using consistent semiconductor manufacturing techniques. This reduces device complexity by eliminating the need to handle, place, and connect multiple separate components, while still allowing for specific VR designs through custom circuit patterns on the substrate.
3Ease of operation
If inductors and capacitors are placed on circuit boards, then the voltage regulator system can be assembled, but the overall size of electronic devices increases
Solution Approach 1:
The patent combines all voltage regulator components (voltage regulator chip, inductors, capacitors) into a single integrated package that functions as one operational unit. This merging maintains ease of operation by providing a complete, ready-to-use voltage regulation system while reducing the board size from what would be required for separately placed components to a compact integrated footprint.
Data Source
AI summary
Provided are an integrated voltage regulator (IVR) package with a minimized size including one or more inductors and one or more capacitors together with an IVR chip and improving characteristics of a voltage regulator (VR), and an IVR system package including the IVR package. The IVR package includes a package substrate, a stacked structure mounted on the package substrate and having a stack structure in which a passive device chip including one or more capacitors and an IVR chip including a voltage regulator are stacked, and an intermediate substrate disposed on the package substrate in a structure surrounding the stacked structure, the intermediate substrate including vias therein. The one or more inductors are included in the stacked structure or the intermediate substrate.