Stacked Laminar Electronic Hardware Assembly for Tamper-Resistant Security
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Solution Overview
Problem
Existing electronic hardware security methods, such as tamper-responsive meshes and in-chip anti-tamper shields, have vulnerabilities, particularly from the base of the die through the substrate, which can be costly and complex to address by wrapping the die with additional meshes.
Innovation Solution
The solution involves stacking two laminar components with each die having a substrate and a protective layer, where the functional region of one die is sandwiched between the protective layers of the other, providing dual-layer protection and heat conduction, and optionally using a dummy die or a lid with anti-tamper layers for enhanced security and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single protective layer is used on a die, then manufacturing is simpler and cost is lower, but security is insufficient against attacks from the base of the die through the substrate
Solution Approach 1:
The patent transitions from a single-layer protective structure to a multi-layer stacked structure, adding vertical dimensionality. Multiple laminar components (first laminar component with first protective layer, second laminar component with second protective layer) are stacked with the functional region between them, providing protection from both top and base directions simultaneously.
Solution Approach 2:
The functional region is nested between two protective layers in a sandwich configuration. The first protective layer and second protective layer enclose the functional region, creating a nested structure where the functional region is protected from both sides by the respective protective layers.
2Reliability
If additional meshes are wrapped around the die to protect against substrate attacks, then security is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The protective function is merged into the die structure itself through the laminar components that are stacked and bonded to the die. Instead of adding separate external meshes, the protective layers are integrated as part of the die's laminar structure, simplifying the manufacturing process while maintaining security.
Solution Approach 2:
Protection is achieved by adding layers in the vertical dimension rather than wrapping external meshes around the die. The first and second laminar components are stacked vertically with the functional region between them, providing protection without requiring additional wrapping operations.
3Reliability
If protective layers are added to both top and base of the die, then security against tampering is enhanced, but heat dissipation capability must be maintained
Solution Approach 1:
The laminar components serve multiple functions simultaneously: they provide security protection through their protective layers while also facilitating heat dissipation through thermal conduction. The stacked structure enables both security and thermal management functions to be achieved by the same structural elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances security by providing comprehensive protection against tampering and heat dissipation while reducing manufacturing complexity and cost, allowing for versatile die configurations and efficient heat management.
Implementation Method 1
providing dual-layer protection and heat conduction
Data Source
Figure 1A~1B
Figure 2
Figure 3
AI summary
The present invention relates to an electronic hardware assembly comprising at least a first and second laminar component, wherein the first laminar components comprises a die, the die comprising a substrate, a functional region and a first protective layer, and the second laminar component comprises a second protective layer, wherein the first and second laminar components are arranged in a stack such that the functional region of the first laminar component is arranged within the assembly substantially between first and second protective layers.