Stacked Laser Chip Carrier for Compact Shared-Optics Layout

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Solution Overview

Problem

Existing laser components are not compact enough for applications near the human eye, such as AR glasses, where a small base area is required.

Innovation Solution

A laser component design featuring edge-emitting semiconductor laser chips attached to opposite sides of a thin connection carrier, allowing for close arrangement of emission regions and a compact form factor.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If multiple laser chips are arranged laterally next to each other, then the base area increases, but the compactness required for AR glasses applications is not achieved

Engineering Contradiction:

Improvebase areaVSAvoidcompactness for AR glasses

Core Design Contradiction:

Volume of moving objectVSAdaptability or versatility

Solution Approach 1:

The patent transitions from a two-dimensional lateral arrangement of laser chips to a three-dimensional configuration by stacking laser chips on opposite sides of a connection carrier. This vertical stacking approach reduces the base area footprint while maintaining multiple laser chip functionality, directly addressing the compactness requirement for AR glasses applications.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a nested structure where multiple laser chips are integrated within a compact connection carrier assembly. The connection carrier serves as a common substrate that hosts multiple laser chips on both its upper and lower sides, creating a space-efficient nested configuration that minimizes the overall base area.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Strength

If laser chips are mounted on a thick connection carrier, then mechanical stability is improved, but the overall component size increases and compactness is reduced

Engineering Contradiction:

Improvemechanical stabilityVSAvoidcomponent size

Core Design Contradiction:

StrengthVSVolume of moving object

Solution Approach 1:

The patent employs a thin connection carrier that provides sufficient mechanical stability while minimizing component thickness. The connection carrier is designed as a thin substrate with integrated metallizations that maintain structural integrity and electrical connectivity without adding excessive bulk, enabling compact laser component design.

Inventive Principle:

Principle #30Flexible shells and thin films

3Area of stationary object

If emission regions are arranged far apart, then each laser chip has adequate space, but the base area increases and shared optics become impractical

Engineering Contradiction:

Improvespace for each laser chipVSAvoidshared optics compatibility

Core Design Contradiction:

Area of stationary objectVSAdaptability or versatility

Solution Approach 1:

The patent merges multiple laser chips onto a single connection carrier with shared metallization structures. The connection carrier provides common electrical connections and mechanical support for multiple laser chips, reducing the overall space requirement and enabling the use of shared optics for light extraction and processing.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS20250030219A1Laser component and method for producing a laser component

Publication Date: 2025.01.23 AMS OSRAM INT GMBH

AI summary

The invention relates to a laser component including a first laser chip with a first emission region, a second laser chip with a second emission region, and a connection carrier with an upper side and an underside, wherein the first laser chip is secured to the upper side of the connection carrier and is electrically connected, the second laser chip is secured to the underside of the connection carrier and is electrically connected, and the connection carrier has a thickness of max. 200 μm.