Stacked Laser Assembly With Side-Surface Contacting for Compact Optics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional laser diode arrangements for virtual and augmented reality applications are complex, expensive, and require significant space due to the need for complex optics and large squint angles, making them unsuitable for compact applications.
Innovation Solution
The proposal involves stacking multiple laser devices on top of each other along one of their main sides to reduce space requirements, allowing for shared potential connections and simplified contacting, while maintaining precise alignment for efficient optics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional laser diodes are arranged on a circuit board with complex optics, then color display accuracy is improved, but device size and complexity increase
Solution Approach 1:
The patent transitions from planar arrangement of laser diodes on a circuit board to a three-dimensional stacked configuration. Multiple laser devices are stacked vertically along the fast axis, with each stack containing laser diodes of different colors (red, green, blue). This vertical stacking in the third dimension eliminates the need for complex optical path compensation while maintaining color accuracy, directly resolving the contradiction between manufacturing precision and device complexity.
Solution Approach 2:
The patent merges multiple laser devices into integrated stacks where red, green, and blue laser diodes are combined in each vertical stack. The stacks are then integrated with waveguides and optics in a unified structure. This merging reduces the number of separate components and simplifies the overall optical system while maintaining the ability to display accurate colors through the stacked configuration.
2Ease of operation
If optics are located outside the package, then alignment flexibility is improved, but device size increases
Solution Approach 1:
The patent merges the optics with the laser device package, creating an integrated structure where the waveguides and optical elements are positioned within or immediately adjacent to the laser stack. This integration eliminates the need for separate external optics while maintaining alignment flexibility through the precise stacking configuration, thereby reducing overall device size without sacrificing operational ease.
Solution Approach 2:
By stacking laser devices vertically and positioning optics in the vertical dimension rather than spreading them out horizontally, the patent achieves compact packaging. The vertical stacking allows optics to be integrated within the package footprint while maintaining alignment flexibility through the stacked architecture, resolving the contradiction between compact size and alignment ease.
3Volume of moving object
If multiple laser devices are stacked vertically, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent employs preliminary alignment actions during the stacking process, where laser devices are pre-positioned and pre-aligned before final bonding. The stacking process includes preliminary positioning steps that ensure precise alignment of the fast axes and optical paths before the devices are permanently bonded together. This preliminary action reduces the complexity of achieving final alignment precision while maintaining compact vertical stacking.
Solution Approach 2:
The patent replaces complex mechanical alignment systems with a standardized stacking process that uses consistent spacing and positioning features. Instead of requiring complex mechanical adjustment mechanisms for each laser device, the design uses uniform stacking heights and integrated mounting structures that automatically provide alignment when devices are stacked, thereby reducing manufacturing complexity while achieving compact size.
4Adaptability or versatility
If individual laser devices are packaged separately, then manufacturing flexibility is improved, but assembly steps increase
Solution Approach 1:
The patent merges multiple laser devices into stacked assemblies that can be manufactured and tested as integrated units. Instead of packaging each laser device separately, the stacks are formed by bonding multiple devices together, reducing the number of separate packaging and assembly steps. This merging maintains manufacturing flexibility through modular stack designs while improving productivity by reducing assembly operations.
Solution Approach 2:
The patent creates universal stack modules that can accommodate different combinations of laser diodes (red, green, blue) in standardized configurations. These multi-functional stacks can be adapted for different applications and color requirements while using the same basic stacking and packaging infrastructure, thereby maintaining manufacturing flexibility while improving assembly efficiency through standardized procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a highly compact, space-saving design with reduced assembly steps and a single burn-in process, enabling cost-effective production of stacked laser arrangements for various color outputs.
Implementation Method 1
a first and at least one second laser device which each comprise a resonator-forming semiconductor body with an active zone
Data Source
AI summary
The invention relates to a stacked laser arrangement with a first laser device with a light-emitting side and a semiconductor body forming a resonator with an active zone and with two main sides and side surfaces arranged essentially perpendicularly thereto, the side surfaces comprising an insulating material. In addition, at least one second laser device with a light-emitting side and a semiconductor body forming a resonator with an active zone and with two main sides and side surfaces arranged substantially perpendicular thereto is provided, the side surfaces comprising an insulating material. The light exit sides of the first laser device and at least one second laser device point in the same direction and the at least one second laser device is arranged on one of the main sides of the first laser device. According to the invention, electrical contact is made to the active zone of the first and at least one second laser device via at least one of their respective side surfaces, in that the insulating material is perforated in places.