Stacked Lateral and Vertical Semiconductor Devices via Leadframe
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Solution Overview
Problem
Existing semiconductor components primarily feature lateral devices, lacking integration of both lateral and vertical semiconductor devices in a stacked configuration, which limits performance and packaging efficiency.
Innovation Solution
A semiconductor component comprising both lateral and vertical semiconductor devices, electrically connected via a leadframe with various connectors, allowing for a stacked structure where the lateral device's first side faces the leadframe, and the vertical device's first side is mounted on the lateral device's second side, enabling series connection and improved packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If only lateral semiconductor devices are used in III-V compound semiconductor components, then the device structure is simple and manufacturing is easier, but the performance and packaging area efficiency are limited
Solution Approach 1:
The patent combines both lateral and vertical semiconductor devices within a single component package. The lateral device (110) and vertical device (120) are integrated together with their respective electrodes connected through a leadframe, merging two different device architectures into one unified component that achieves both manufacturing feasibility and improved packaging efficiency
Solution Approach 2:
The invention transitions from using only lateral devices (two-dimensional electrode arrangement) to incorporating vertical devices (three-dimensional electrode arrangement). The vertical device adds a vertical dimension to the electrode configuration, allowing for better space utilization and improved packaging area efficiency while maintaining compatibility with existing manufacturing processes
2Productivity
If both lateral and vertical semiconductor devices are integrated in a stacked configuration, then performance and packaging area efficiency are improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The leadframe serves as an intermediary component that facilitates the electrical connection between the lateral device (110) and vertical device (120). The leadframe's multiple portions and connectors provide a structured pathway for electrical connections, reducing the complexity of integrating two different device types while maintaining improved packaging efficiency
Solution Approach 2:
The component is segmented into distinct functional modules: the lateral device (110) with its first and second electrodes, the vertical device (120) with its first and second electrodes, and the leadframe with multiple portions (131-135). This segmentation allows each module to be optimized independently while simplifying the overall integration process through standardized connection interfaces
3Ease of manufacture
If lateral semiconductor devices are used, then the conductive channel formation is simpler using band gap differences, but the current handling capability and power performance are limited compared to vertical devices
Solution Approach 1:
The patent merges the lateral device (110) with its simple band-gap-based conductive channel formation with the vertical device (120) that provides superior current handling capability. By combining these two device types in a stacked configuration with proper electrical connections through the leadframe, the component achieves both manufacturing simplicity and enhanced power performance
Data Source
AI summary
A semiconductor component comprising a lateral semiconductor device, a vertical semiconductor device, and a leadframe is provided. The lateral semiconductor device has a first side and a second side, and a first electrode, a second electrode, and a control electrode positioned on the first side. The vertical semiconductor device has a first side and a second side, a second electrode and a control electrode of it positioned on the second side and a first electrode of it positioned on the first side. The leadframe electrically and respectively connected to each of the first electrode of the lateral semiconductor device, the second electrode of the lateral semiconductor device, the second electrode of the vertical semiconductor device, and the control electrodes, wherein the first side of the vertical semiconductor device is mounted on the second side of the lateral semiconductor device, and the first electrodes of both devices are electrically connected.