Stacked LC Filter Layout for Low-Side Attenuation Pole Tuning
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Solution Overview
Problem
Conventional LC filters with four resonators disposed in a staggered manner lack an attenuation pole on the low-frequency side, restricting the adjustment of bandpass characteristics, making it difficult to achieve desired bandpass characteristics.
Innovation Solution
The LC filter design includes a configuration where multiple dielectric layers are laminated, with specific capacitors and via conductors arranged to allow for easy adjustment of bandpass characteristics by varying the intervals between capacitor electrodes, enabling the introduction of attenuation poles on both low and high-frequency sides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If four LC resonators are disposed in a staggered manner, then magnetic coupling between resonators is strengthened and pass band is widened, but no attenuation pole occurs on the low-frequency side and adjustment of bandpass characteristics is restricted
Solution Approach 1:
The patent transitions from a conventional planar arrangement to a three-dimensional stacked configuration with multiple dielectric layers. The LC resonators are arranged across different layers (first layer: resonators 101, 102; second layer: resonators 103, 104) with vertical coupling through via conductors, enabling control of bandpass characteristics including the introduction of low-frequency attenuation poles while maintaining pass band width.
Solution Approach 2:
The filter structure is segmented into multiple independent dielectric layers, each containing specific LC resonators and capacitor electrodes. This segmentation allows independent optimization of each layer's contribution to the overall frequency response, enabling precise control over attenuation pole positions and pass band characteristics through inter-layer coupling design.
2Device complexity
If four LC resonators are disposed in a straight manner, then device complexity is reduced, but magnetic coupling between resonators is weaker and pass band cannot be widened
Solution Approach 1:
The patent employs a three-dimensional stacked architecture with resonators distributed across multiple dielectric layers coupled through via conductors. This vertical arrangement achieves strong magnetic coupling and wide pass band without requiring complex planar layouts, as the coupling is established through the vertical dimension rather than intricate horizontal positioning.
3Ease of manufacture
If conventional staggered arrangement is used, then manufacturing is simplified, but bandpass characteristic adjustment is restricted and desired frequency responses cannot be achieved
Solution Approach 1:
The patent introduces adjustable coupling mechanisms between dielectric layers through via conductors and capacitor electrodes. The coupling strength can be dynamically controlled by adjusting the position, size, or configuration of these conductive elements, enabling flexible tuning of bandpass characteristics including the introduction and positioning of attenuation poles while maintaining manufacturing feasibility.
Solution Approach 2:
The patent enables control of bandpass characteristics by varying physical parameters such as the distance between capacitor electrodes in different layers, the dimensions of via conductors, and the permittivity of dielectric materials. These parameter changes allow precise adjustment of coupling coefficients and resonance frequencies to achieve desired frequency responses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for precise adjustment of bandpass characteristics, enabling the widening of the pass band and shifting of attenuation poles, thereby improving the flexibility in achieving desired frequency responses.
Implementation Method 1
The first via conductor extends in the laminating direction. The first capacitor electrode is connected to one end of the first via conductor and faces the first ground electrode in the laminating direction
Implementation Method 2
The first capacitor electrode is connected to one end of the first via conductor and faces the first ground electrode in the laminating direction
Implementation Method 3
In a case where the four LC resonators are disposed in a staggered manner, magnetic coupling between LC resonators is stronger than in a case where the four LC resonators are disposed in a straight manner, and therefore a pass band of the band pass filter can be widened
Data Source
AI summary
An LC filter includes a first capacitor electrode connected to one end of a first via conductor and faces a first ground electrode in a laminating direction. A second capacitor electrode is connected to one end of a second via conductor and faces the first ground electrode in the laminating direction. A third capacitor electrode is connected to one end of a third via conductor and faces the first ground electrode in the laminating direction. A fourth capacitor electrode is connected to one end of a fourth via conductor and faces the first ground electrode in the laminating direction. The second capacitor electrode faces each of the first capacitor electrode, the third capacitor electrode, and the fourth capacitor electrode in a direction orthogonal or substantially orthogonal to the laminating direction.