Stacked LCD Substrates With Shielding for Signal Interference

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Solution Overview

Problem

Existing liquid crystal displays face challenges in improving display quality and efficiency, particularly in reducing signal interference and optimizing space utilization for thin film transistors and sensing units.

Innovation Solution

The liquid crystal display design includes a first and second substrate with thin film transistors and sensing units, where the substrates are separated by a liquid crystal layer, and employs shielding layers to reduce light and electric field interference, and varies the width-to-length ratio of channels in the transistors to enhance performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If thin film transistors and sensing units are disposed on the same substrate, then device integration is improved, but signal interference increases

Engineering Contradiction:
Improvedevice integrationVSAvoidsignal interference
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent divides the device into two separate substrates: the first substrate contains thin film transistors while the second substrate contains sensing units. This segmentation physically separates components that generate electromagnetic signals from those that detect signals, reducing mutual interference while maintaining high device integration through the stacked configuration.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces shielding layers as intermediary elements between the thin film transistors and sensing units. These shielding layers act as mediators that block or attenuate electromagnetic signals from the transistors, preventing them from interfering with the sensing units while allowing the system to maintain compact integration.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If shielding layers are added to reduce interference, then signal quality is improved, but device complexity increases

Engineering Contradiction:
Improvesignal qualityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the shielding function with existing structural elements of the display device. The shielding layers are integrated into the substrate stack as part of the overall device architecture, combining multiple functions (structural support, signal shielding, and component mounting) into unified layers, thereby improving signal quality without proportionally increasing device complexity.

Inventive Principle:
Principle #5Merging (Combining)

3Adaptability or versatility

If substrate area is increased to accommodate more transistors and sensing units, then functionality is improved, but display area is reduced

Engineering Contradiction:
ImprovefunctionalityVSAvoiddisplay area
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent transitions from a planar layout to a three-dimensional stacked configuration. By disposing thin film transistors on the first substrate and sensing units on the second substrate in a vertical stack, the design utilizes the vertical dimension to accommodate additional functional components without expanding the horizontal footprint, thereby maintaining full display area while enhancing device functionality.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12498600B2Electronic devices
Publication Date: 2025.12.16 INNOLUX CORP
  • US12498600B2 patent drawing
  • US12498600B2 patent drawing
  • US12498600B2 patent drawing

AI summary

An electronic device is provided. The electronic device includes a first substrate, a second substrate, a first transistor, a second transistor, a passivation layer, a conductive through hole, an electrode, and a shielding layer. The second substrate overlaps the first substrate. The first transistor is disposed on the first substrate. The second transistor is disposed on the second substrate. The passivation layer is disposed between the first substrate and the second substrate. The conductive through hole penetrates the passivation layer. The electrode is disposed between the first substrate and the second substrate and electrically connected to the first transistor through the conductive through hole. The shielding layer is disposed between the first transistor and the second transistor and overlaps the conductive through hole.