Electronic Component with Stacked Leadframes for Thermal Stress
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Solution Overview
Problem
Electronic components packaged with asymmetric die pads and support structures are prone to deformation due to thermal stress, caused by differences in thermal expansion coefficients of various component parts.
Innovation Solution
The use of two stacked leadframes, one with a die pad and the other with an opposing pad, positioned to oppose each other, creating a more symmetric internal structure that reduces sensitivity to thermal stress, with support structures embedded within a plastic package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single leadframe with an offset die pad is used, then the chip can be mounted and electrically connected, but the component becomes asymmetric and sensitive to thermal stress causing deformation
Solution Approach 1:
The patent applies asymmetry in a controlled manner by using two offset die pads positioned at opposite sides of the leadframe, creating a balanced asymmetric structure. Each die pad is offset from the center, but their symmetric opposition to each other compensates for the individual asymmetry, allowing chip mounting while maintaining overall structural balance against thermal stress
Solution Approach 2:
The second offset die pad acts as a counterweight to the first offset die pad. By positioning them at opposite sides with equal offset distances, the structure creates a balanced configuration where the thermal expansion stresses on opposite sides counterbalance each other, preventing the deformation that would occur with a single asymmetric die pad
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the structural symmetry and rigidity of the electronic component, minimizing the impact of thermal stress and improving its stability and reliability.
Implementation Method 1
The package may be deformed by thermal stress due to this asymmetry and the differences in thermal expansion coefficients in the various parts of the component.
Data Source
AI summary
An electronic component comprising a plastic package and an electric chip which is inside the package. The electronic component comprises a metallic die pad and a metallic first support structure extends from the die pad to a first support point on one of the side surfaces of the plastic package. The electronic component also comprises a metallic opposing pad and a metallic second support structure which extends from the opposing pad to a second support point on one of the side surfaces of the plastic package.