Stacked Leadframe Routing Circuit for Semiconductor Package Interconnects

The patent divides the routing function into multiple separate leadframe layers (base leadframe, intermediate leadframes, top leadframe), each handling specific routing tasks. This segmentation allows complex electrical communication paths to be broken down into manageable segments across multiple layers, improving reliability while organizing complexity systematically

The patent transitions from planar routing to three-dimensional stacked routing by adding the vertical dimension with multiple leadframe layers. This dimensional change enables additional routing paths and connectivity options without increasing the footprint, thereby improving electrical communication reliability while distributing complexity across multiple dimensions

The patent segments the thermal and mechanical support function across multiple leadframe layers, with each layer contributing to overall structural integrity. The base leadframe provides foundational support while intermediate and top leadframes add distributed reinforcement, improving thermal conduction paths and mechanical strength without concentrating stress or heat in a single layer

The patent employs composite construction by stacking multiple leadframe materials and combining them with die attach materials, mold compound, and wire bonds. This composite approach creates a multi-material structure that optimizes both thermal conduction and mechanical properties across different layers, enhancing overall reliability while distributing manufacturing precision requirements across multiple material interfaces