Stacked Multi-Color LED Structure With Integrated Adhesive Coupling
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Solution Overview
Problem
Conventional light emitting diodes (LEDs) used in display devices face challenges in achieving a compact and efficient structure for multi-color emission, particularly in micro LED displays where precise color mixing and reduced manufacturing complexity are required.
Innovation Solution
A light emitting device with a stacked structure comprising multiple LED parts, each emitting different colors, connected by adhesive and conductive coupling patterns and through structures, allowing for efficient electrical coupling and increased light emitting area without the need for complex etching processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple LED parts are stacked vertically to achieve compact multi-color emission, then the device size is reduced and light emitting area is increased, but the electrical connection complexity and manufacturing precision requirements increase
Solution Approach 1:
The patent combines adhesive and conductive functions into a single integrated coupling pattern layer. The coupling patterns are formed directly within the adhesive material, merging the mechanical bonding function with the electrical connection function, thereby reducing device complexity while maintaining vertical stacking for compact multi-color emission
Solution Approach 2:
The adhesive layer serves multiple functions simultaneously: it provides mechanical adhesion between stacked LED parts, establishes electrical connections through embedded coupling patterns, and enables both n-type and p-type electrical connections depending on the pattern design. This multi-functionality reduces the need for separate adhesive and conductive layers
2Ease of manufacture
If conventional separate adhesive and conductive layers are used in stacked LEDs, then manufacturing is simpler, but device size increases and electrical reliability decreases
Solution Approach 1:
The patent merges separate adhesive and conductive layers into a single integrated structure where coupling patterns are embedded within the adhesive material. This reduces the total number of layers and device thickness while maintaining manufacturing feasibility through established adhesive deposition and patterning techniques
3Reliability
If complex etching processes are used to create electrical connections in stacked LEDs, then electrical reliability improves, but manufacturing complexity and cost increase
Solution Approach 1:
The patent performs preliminary action by pre-forming the coupling patterns within the adhesive material before stacking the LED parts. This advance preparation ensures precise electrical connection alignment and reduces the need for complex post-stack etching processes, thereby maintaining electrical reliability while simplifying manufacturing
Solution Approach 2:
The adhesive material serves as an intermediary that facilitates electrical connections between stacked LED parts. By embedding coupling patterns within the adhesive, the patent creates a mediator structure that simultaneously provides mechanical bonding and electrical connectivity, eliminating the need for complex etching through the adhesive layer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact, efficient, and reliable multi-color emission with improved electrical reliability and reduced manufacturing complexity, facilitating the production of micro LED displays with enhanced performance.
Implementation Method 1
a first adhesion layer disposed between the first and second light emitting parts and including first coupling patterns that are adhesive and conductive
Implementation Method 2
Light emitting diodes, as inorganic light sources, are being diversely used in various fields
Implementation Method 3
Each pixel of a display device may include blue, green, and red sub-pixels
Data Source
AI summary
A light emitting device including a first light emitting part including a first n-type semiconductor layer, a first active layer, a first p-type semiconductor layer, and a first transparent electrode, a second light emitting part disposed over the first light emitting part and including a second n-type semiconductor layer, a second active layer, a second p-type semiconductor layer, and a second transparent electrode, and a third light emitting part disposed over the second light emitting part and including a third n-type semiconductor layer, a third active layer, a third p-type semiconductor layer, and a third transparent electrode, in which the light emitting device has substantially a quadrangular shape when viewed from the top, and has first to fourth corners.