Stacked LED Chip Groups for High CRI White Light
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Solution Overview
Problem
Existing white light emitting components face challenges in achieving high light emitting efficiency, high driving voltage, high color render index (CRI), and concentrated optical density, particularly due to low light conversion efficiency of fluorescent materials and separate disposal of blue and red light emitting diodes.
Innovation Solution
A white light emitting component is formed by stacking miniature AlInGaN-based and AlInGaPN-based light emitting diode chip groups in series, with a wavelength conversion fluorescent material that absorbs and converts light across different wavelength ranges, allowing for high driving voltage and efficient light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fluorescent materials are used for wavelength conversion, then color render index is improved, but light emitting efficiency deteriorates due to low light conversion efficiency
Solution Approach 1:
The patent divides the wavelength conversion function into multiple fluorescent materials with different conversion characteristics. Instead of using a single fluorescent material, multiple materials are employed to convert different portions of the blue light spectrum to red light, thereby improving overall conversion efficiency while maintaining high color render index.
Solution Approach 2:
The patent uses composite fluorescent material systems combining multiple phosphors with complementary emission spectra. These composite materials work synergistically to achieve both high color render index and improved light conversion efficiency by covering broader spectral ranges with higher overall quantum efficiency.
2Device complexity
If blue and red light emitting diodes are disposed separately, then device complexity is reduced, but light emitting efficiency and optical density deteriorate
Solution Approach 1:
The patent combines blue light emitting diodes and red light emitting diodes into a single integrated chip structure. This merging allows for closer spatial arrangement of the light sources, improving optical density and light emitting efficiency while maintaining manageable device complexity through integrated design.
Solution Approach 2:
The patent employs a nested structure where red light emitting diodes are positioned within or around the blue light emitting diode structure. This nesting arrangement maximizes space utilization, improves optical interaction between the different wavelength sources, and enhances overall light emitting efficiency without significantly increasing device complexity.
3Loss of energy
If driving voltage is increased, then light emitting efficiency is improved, but device reliability deteriorates due to high voltage stress
Solution Approach 1:
The patent implements dynamic voltage distribution across the stacked diode structure, where different voltage levels are applied to different sections. This dynamic approach allows optimization of light emitting efficiency at each stage while distributing voltage stress to prevent breakdown, thereby maintaining device reliability.
Solution Approach 2:
The patent changes the electrical parameters (voltage, current) at different stages of the stacked diode structure. By optimizing the voltage-current characteristics at each layer, the system achieves high overall light emitting efficiency while preventing any single point from experiencing excessive voltage stress that would compromise reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases color render index and light emitting efficiency while enabling high driving voltage and concentrated optical density, enhancing the overall performance of the white light emitting component.
Implementation Method 1
a wavelength conversion fluorescent material, and a coating resin. The wavelength conversion fluorescent material is mixed into the coating resin
Implementation Method 2
a first light emitting diode chip group and a second light emitting diode chip group. The first light emitting diode chip group is configured for emitting a first light. The second light emitting diode chip group is configured for emitting a second light
Data Source
AI summary
A light emitting component, and more particularly to a white light emitting component with high light emitting efficiency are provided. The white light emitting component with high light emitting efficiency has properties of high driving voltage, high color render index and concentrated optical density. The light emitting component includes a plurality of different light emitting diode chip groups for emitting a number of lights in different wavelength ranges and a wavelength conversion fluorescent material. A manufacturing method by stacking miniature light emitting diode chip groups to form the white light emitting component is also provided.