Stacked LED Chip Layout for Uniform Color Mixing

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Solution Overview

Problem

Existing LED devices face challenges in achieving a consistent color profile due to variations in color mixing when LEDs of different colors are placed side by side, leading to inconsistencies in light emission across different angles and locations.

Innovation Solution

The solution involves mounting multiple LED devices in a stacked configuration, allowing for better light mixing by aligning them partially, which can include various stacking manners and configurations such as flip-chip and lateral configurations, with wavelength conversion elements and light-diffusing layers to achieve desired color mixing profiles.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If LEDs of different colors are placed side by side to obtain desired color profile, then light mixing can be achieved, but color consistency varies depending on location and angle

Engineering Contradiction:
Improvelight mixingVSAvoidcolor consistency
Core Design Contradiction:
Illumination intensityVSManufacturing precision

Solution Approach 1:

The patent transitions from a planar side-by-side LED arrangement to a three-dimensional stacked configuration. Multiple LED chips are vertically stacked and aligned along the optical axis, allowing light to mix in the vertical dimension before exiting. This dimensional change ensures that all LEDs contribute uniformly to the mixed light regardless of viewing angle or lateral position, resolving the color consistency issue while maintaining effective light mixing.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If LEDs are placed side by side in close proximity, then device area is reduced, but color mixing profile varies with angle and location

Engineering Contradiction:
Improvedevice areaVSAvoidcolor mixing profile
Core Design Contradiction:
Area of stationary objectVSStability of the object's composition

Solution Approach 1:

The invention moves the LED arrangement from a two-dimensional planar layout to a three-dimensional vertical stack. By aligning multiple LED chips along the optical axis in the vertical dimension, the device achieves compact footprint while ensuring uniform color mixing profile that remains stable across different viewing angles and locations.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a nested configuration where multiple LED chips are stacked vertically within a compact structure. Each LED chip is positioned within the vertical stack, with their light paths overlapping and mixing before exiting the device. This nesting approach minimizes the device area while maintaining consistent color mixing characteristics.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Manufacturing precision

If multiple LED chips are stacked and aligned, then light mixing and color consistency are improved, but device structure becomes more complex

Engineering Contradiction:
Improvecolor consistencyVSAvoidstacked configuration
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent divides the LED device into multiple discrete chip segments stacked vertically. Each LED chip can be independently fabricated and then assembled into the stack. This segmentation allows for modular manufacturing, where standardized chips are stacked and aligned using automated processes, reducing the overall manufacturing complexity despite the multi-chip structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The stacked LED configuration serves multiple functions simultaneously: it achieves uniform color mixing, maintains compact device area, enables independent chip fabrication, and provides flexible color tuning by selecting different LED chip combinations. This multi-functionality justifies the increased structural complexity by delivering superior performance across multiple parameters.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances light mixing and emission uniformity, reducing color variations across angles and locations, resulting in improved color consistency and emission patterns for LED devices.

Implementation Method 1

a wavelength conversion element is mounted on the first LED chip

Methodology Applied
Scientific EffectWavelength conversion: Photoluminescence

Data Source

PatentUS20250006712A1Stacked LED chips
Publication Date: 2025.01.02 CREELED INC
  • US20250006712A1 patent drawing
  • US20250006712A1 patent drawing
  • US20250006712A1 patent drawing

AI summary

Embodiments of a light-emitting diode (LED) device are disclosed. In some embodiments, the LED device includes a first LED device and one or more other LED devices mounted to the first LED device. By mounting the other LED devices to the first LED device, the LED devices are arranged in a stacked configuration. This allows for better light mixing of the light emitted by the various LED devices since the LED devices are at least partially aligned with one another. Different manners of stacking the LED devices are disclosed. The scope of the disclosure includes the specific embodiments disclosed as well as other combinations depending on the color mixing profile that is desired.