Stacked LED Module Architecture for Compact Headlamp Control
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Solution Overview
Problem
The existing light emitting diode modules for vehicle headlamps face issues with increased size due to multiple LEDs, leading to restricted vehicle design flexibility and limited space for additional driving controllers, resulting in inefficient heat dissipation and control precision.
Innovation Solution
A light emitting diode module design featuring multiple substrates with separated light emitting diode packages and driving controllers, allowing for reduced printed circuit board size and improved heat dissipation through spaced circuit boards, enabling flexible design and precise control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple light emitting diodes are disposed in a light emitting diode package, then the lighting coverage and brightness are improved, but the number of driving controllers increases and the module size increases
Solution Approach 1:
The patent divides the light emitting diode package into multiple independently controllable groups, where each group can be driven by a separate driving controller. This segmentation allows the system to maintain multiple driving controllers for enhanced lighting coverage while enabling selective activation of only necessary groups, thereby managing complexity through modular organization.
Solution Approach 2:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration by placing substrate layers vertically. Multiple substrate layers are arranged in the vertical dimension, allowing multiple light emitting diode groups to be disposed at different heights, thereby increasing lighting coverage without proportionally increasing the horizontal footprint and managing controller complexity through spatial optimization.
2Illumination intensity
If the number of mounted light emitting diodes increases, then the lighting performance is improved, but the size of the light emitting diode module increases
Solution Approach 1:
The patent utilizes vertical stacking of multiple substrate layers to arrange light emitting diodes in the vertical dimension rather than spreading them horizontally. This three-dimensional arrangement allows a higher density of light emitting diodes to be mounted within a compact horizontal footprint, thereby improving lighting performance without proportionally increasing the overall module size.
Solution Approach 2:
The patent implements a nested structure where multiple substrate layers are stacked vertically with each layer containing light emitting diode groups. The driving controllers on lower layers are positioned beneath the light emitting diodes on upper layers, creating a compact nested arrangement that maximizes the number of mounted light emitting diodes within a limited horizontal space.
3Illumination intensity
If the size of the light emitting diode module increases, then the lighting coverage is improved, but the space for vehicle headlamp installation is limited
Solution Approach 1:
The patent transitions from a two-dimensional planar layout to a three-dimensional stacked configuration, arranging multiple substrate layers vertically. This vertical arrangement allows the light emitting diode module to achieve extended lighting coverage through increased vertical height while maintaining a compact horizontal footprint, thereby fitting within the limited space constraints of vehicle headlamp installations.
4Measurement precision
If multiple driving controllers are used to control individual light emitting diodes, then the control precision is improved, but the device complexity and size increase
Solution Approach 1:
The patent divides the light emitting diode package into multiple independently controllable groups, with each group assigned to a specific driving controller. This segmentation enables precise individual control of each light emitting diode group while organizing the multiple driving controllers into a structured modular framework, thereby maintaining control precision while managing system complexity through systematic division.
Solution Approach 2:
The patent arranges driving controllers and light emitting diode groups across multiple vertical layers, with driving controllers positioned on lower substrate layers and their corresponding light emitting diodes on upper layers. This vertical stacking in the third dimension allows multiple driving controllers to be integrated into a compact space, maintaining control precision while reducing the horizontal footprint and overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a compact printed circuit board size, enhances design flexibility, improves heat dissipation, and increases control precision, reducing the overall size of the lighting apparatus while maintaining performance.
Implementation Method 1
A light emitting diode is an inorganic semiconductor device that emits light generated through recombination of electrons and holes
Implementation Method 2
The first light control layer may include a material that reflects light
Data Source
Figure 1~2A
Figure 2B
Figure 2C
AI summary
A light-emitting diode module according to one embodiment comprises a first substrate and a second substrate positioned in one direction of the first substrate, wherein the first substrate includes a light-emitting diode package on which at least one light-emitting unit for generating and emitting light is disposed, the light-emitting diode package includes a dam portion for encompassing the light-emitting unit, and the first substrate and the second substrate include overlapping regions that overlap each other.