Stacked LED Package With Integrated Drive Circuit for Local Dimming
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Solution Overview
Problem
Existing backlight units struggle to achieve high black contrast due to incomplete blocking of white light, leading to light leakage on black screens, and are hindered by complex circuitry, high manufacturing costs, and difficulties in constructing uniform surface light sources with numerous light-emitting elements and dimming blocks.
Innovation Solution
A light-emitting stacked package with a driving circuit part, where a light-emitting element is mounted on a semiconductor chip with a formed driving circuit, reducing wiring length and improving light extraction efficiency, enabling a thin display with minimized components and enhanced optical characteristics, such as a wider light beam angle, to achieve a uniform surface light source and increased black-and-white contrast ratio.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a large number of light-emitting elements and dimming blocks are constructed on a display plane, then local dimming capability is improved, but circuit complexity and manufacturing cost increase significantly
Solution Approach 1:
The patent merges the light-emitting element and drive IC into a single integrated package, where the drive IC is formed on the same substrate as the light-emitting element. This integration eliminates the need for separate mounting of drive ICs around each light-emitting element, significantly reducing circuit complexity and the number of electrical connections required while maintaining local dimming capability
Solution Approach 2:
The integrated package serves multiple functions within a single component: the substrate acts as both the mounting platform for the light-emitting element and the circuit board for the drive IC, while the package structure provides both optical functions (light emission and control) and electrical functions (power supply and signal transmission) simultaneously
2Ease of operation
If drive ICs are disposed around light-emitting elements, then control functionality is achieved, but mounting space is consumed and manufacturing complexity increases
Solution Approach 1:
The drive IC is nested within the same package structure as the light-emitting element, with the drive IC mounted on the back surface or side walls of the package rather than occupying external space around the light-emitting element. This nesting approach allows control functionality to be achieved while minimizing the overall package footprint and mounting space requirements
3Ease of manufacture
If multiple processes are used to mount light-emitting elements and control parts, then assembly is achieved, but defect rate increases and manufacturing efficiency decreases
Solution Approach 1:
The drive IC is pre-mounted and electrically connected to the light-emitting element during the package manufacturing process before the final assembly. This preliminary action ensures that electrical connections are established under controlled manufacturing conditions rather than during subsequent assembly operations, reducing the risk of connection defects and improving overall manufacturing reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly improves light extraction efficiency, reduces manufacturing complexities and costs, and enhances black-and-white contrast ratios by integrating control elements directly on the semiconductor chip, allowing for a thinner and more uniform surface light source with fewer light-emitting devices.
Implementation Method 1
a backlight light-emitting diode for display is a light-emitting device that converts electricity into light by using the properties of a compound semiconductor
Data Source
AI summary
Provided are a light-emitting stacked package having a driving circuit part which can be used for display or lighting, a backlight unit, and a method of fabricating the light-emitting stacked package having a driving circuit part. More particularly, the light-emitting stacked package having a driving circuit part includes a driving circuit part including at least one driving circuit; and a light-emitting element part including at least one light-emitting element seated on and electrically connected to the driving circuit part so as to be supplied with driving power from the driving circuit part.