Stacked LED Light-Emitting Structure for Compact Full-Color Pixels
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Solution Overview
Problem
Existing LED display apparatuses face challenges in reducing the size of LED chips while maintaining luminous area and efficiency, leading to increased manufacturing time and complexity due to the need for precise mounting of multiple sub-pixels on a two-dimensional plane.
Innovation Solution
A light emitting device comprising multiple stacked LED sub-units with conductive adhesive layers for electrical connection, allowing for reduced chip size and increased luminous area, and a protection layer for handling and packaging, enabling efficient color mixing and simplified manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If one LED chip is arranged in each sub-pixel on a two-dimensional plane, then the display apparatus can show various colors, but the number of LED chips increases and requires excessive time for mounting process
Solution Approach 1:
The patent transitions from a two-dimensional arrangement of LED chips to a three-dimensional stacked configuration. Multiple LED chips emitting different colors (blue, green, red) are vertically stacked and bonded together, allowing color mixing within a single pixel location. This vertical stacking eliminates the need for multiple separate chips per pixel, significantly reducing the number of mounting operations required while maintaining full-color display capability.
2Area of stationary object
If the area of each LED chip is reduced to arrange sub-pixels in a restricted area, then more sub-pixels can be arranged, but it causes difficulty in mounting LED chips and reduces luminous areas
Solution Approach 1:
By stacking LED chips vertically in the third dimension, the patent achieves high pixel density without reducing the lateral area of individual chips. Each stacked chip maintains its full luminous area while multiple colors are combined within the same footprint. This approach avoids the manufacturing difficulties associated with mounting extremely small chips while maximizing the use of available pixel area.
Solution Approach 2:
The patent merges multiple LED chips of different colors into a single stacked structure that functions as one integrated light-emitting unit. The chips are bonded together with adhesive layers and electrically connected through conductive patterns, creating a unified component that can be mounted as a single unit rather than multiple separate chips, thereby simplifying the mounting process.
3Adaptability or versatility
If multiple LED chips are arranged in a two-dimensional plane, then various colors can be displayed, but a relatively large area is occupied by one pixel
Solution Approach 1:
The patent resolves the area conflict by moving from horizontal spread to vertical stacking. Multiple LED chips emitting blue, green, and red light are arranged in vertical layers, allowing their light to mix and produce various colors within a compact footprint. This three-dimensional arrangement dramatically reduces the lateral area occupied by each pixel while maintaining full-color display capability through optical mixing of the stacked chips.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for a higher integration density of colors in a smaller area, reducing the number of LED chips required and simplifying the mounting process, while maintaining or improving luminous efficiency and handling stability.
Implementation Method 1
one of the first adhesive layer and the second adhesive layer electrically connects adjacent light emitting stacks
Implementation Method 2
a first light emitting stack, a second light emitting stack, and a third light emitting stack each including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer
Data Source
AI summary
A light emitting device including a first light emitting stack, a second light emitting stack, and a third light emitting stack each including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, a first adhesive layer bonding the first light emitting stack and the second light emitting stack, and a second adhesive layer bonding the second light emitting stack and the third light emitting stack, in which the second light emitting stack is disposed between the first light emitting stack and the third light emitting stack, and one of the first adhesive layer and the second adhesive layer electrically connects adjacent light emitting stacks.