Stacked Lens Structure with Intermediary Support Substrate

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Solution Overview

Problem

The wafer-level lens process faces challenges in achieving shape and position accuracy for stacked lenses, particularly in manufacturing stacked lens structures for camera modules, where three or more layers are difficult to achieve in mass production.

Innovation Solution

A camera module with a stacked lens structure comprising substrates with lenses, where through-holes are formed and lenses are directly bonded between substrates, allowing for precise adjustment of the distance between the lens structure and the light receiving element using a drive unit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If wafer substrates are stacked to manufacture a stacked lens structure, then the complexity of the manufacturing process increases, but mass production of three layers or more is not realized

Engineering Contradiction:

Improveshape accuracy and position accuracy of stacked lensesVSAvoiddifficulty of stacking process

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent introduces a support substrate as an intermediary carrier that holds multiple wafer substrates during the stacking process. This mediator enables precise positioning and alignment of multiple lenses while facilitating mass production, resolving the contradiction between manufacturing precision and ease of manufacture

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The manufacturing process is segmented into distinct steps: forming lenses on separate wafer substrates, mounting them on a support substrate in predetermined positions, and then stacking. This segmentation allows each step to be optimized independently, improving both precision and manufacturability of multi-layer stacked structures

Inventive Principle:

Principle #1Segmentation

2Ease of manufacture

If lens material is used as adhesive to stack wafer substrates, then the manufacturing process is simplified, but shape accuracy and position accuracy deteriorate

Engineering Contradiction:

Improvesimplicity of stacking processVSAvoidshape accuracy and position accuracy

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The support substrate serves as a mediator that enables precise positioning of wafer substrates before final stacking. This intermediary structure allows for accurate alignment to be maintained even when using simplified adhesive bonding methods, thus preserving manufacturing precision while improving ease of manufacture

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables the creation of camera modules with high accuracy and versatility, capable of being used for various purposes by overcoming the limitations of shape and position accuracy in stacked lens structures, allowing for effective light convergence and improved optical performance.

Implementation Method 1

a light receiving element configured to receive incident light converged by the lenses

Methodology Applied

Scientific EffectRefraction: Refraction

Implementation Method 2

a drive unit configured to adjust a distance between the stacked lens structure and the light receiving element

Methodology Applied

Scientific EffectElectromagnetic actuation: Electromagnetic Induction

Data Source

PatentUS11543621B2AF module, camera module, and electronic apparatus

Publication Date: 2023.01.03 SONY SEMICON SOLUTIONS CORP

AI summary

There is provided a camera module including a stacked lens structure including a plurality of lens substrates. The plurality of lens substrates includes a first lens substrate including a first lens that is disposed at an inner side of a through-hole formed in the first lens substrate, and a second lens substrate including a second lens that is disposed at an inner side of a through-hole formed in the second lens substrate, wherein the first lens substrate is directly bonded to the second lens substrate. The camera module further includes an electromagnetic drive unit configured to adjust a distance between the stacked lens structure and a light-receiving element.