Stacked LiDAR Module Volume Reduction via Chip Integration
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Solution Overview
Problem
LiDAR systems face challenges in minimizing mechanical volume, electrical power transmission, and thermal management, making it difficult to integrate all components within a small form factor.
Innovation Solution
The assembly of a LiDAR module within the XY form factor of a silicon photonics chip by directly mounting optical components over the chip, utilizing the chip's ability to carry electrical power and provide heat spreading benefits, thereby reducing overall volume and improving thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If all LiDAR components are placed in a small XY form factor, then the overall mechanical volume is reduced, but it becomes difficult to integrate all components and manage electrical power transmission and thermal management
Solution Approach 1:
The patent merges multiple LiDAR components (optical components, electrical power transmission paths, and thermal management functions) into a single integrated module. The optical components are mounted on a substrate that simultaneously provides electrical power distribution networks and thermal conduction pathways, combining three separate system functions into one unified structure.
Solution Approach 2:
The patent transitions from a planar 2D layout to a three-dimensional stacked architecture. Optical components are positioned at different vertical levels above the substrate, with electrical power transmission occurring through vertical vias and thermal management through underlying heat sinks, effectively utilizing the Z-dimension to reduce XY footprint while maintaining component separation and functionality.
2Volume of moving object
If optical components are directly mounted over the silicon photonics chip, then the overall volume is reduced and thermal performance is improved, but electrical power transmission and thermal management become more challenging
Solution Approach 1:
The substrate serves as an intermediary structure that simultaneously handles electrical power transmission and thermal management. It includes integrated power distribution networks with conductive traces and vias that efficiently deliver power to mounted optical components, while also providing thermal conduction pathways to conduct heat away from high-power components.
3Volume of moving object
If optical components are directly mounted over the silicon photonics chip, then the overall volume is reduced, but thermal management becomes more challenging
Solution Approach 1:
The substrate serves as an intermediary structure that simultaneously handles electrical power transmission and thermal management. It includes integrated power distribution networks with conductive traces and vias that efficiently deliver power to mounted optical components, while also providing thermal conduction pathways to conduct heat away from high-power components.
Solution Approach 2:
The substrate structure provides self-service thermal management by incorporating heat sinks and thermal conduction pathways directly into its design. The mounting structure itself becomes the heat dissipation mechanism, eliminating the need for separate thermal management components and reducing overall system volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a compact LiDAR system with efficient electrical power transmission and enhanced thermal management, achieving a smaller mechanical volume while maintaining effective range and velocity information extraction.
Implementation Method 1
the silicon photonics chip is capable of carrying electrical current to transmit electrical power to the optical components
Implementation Method 2
The material properties of the silicon photonics chip also provide heat spreading benefits for heat generating components
Implementation Method 3
A FMCW LiDAR system mixes a local oscillator (LO) signal (e.g., LO beam) with a target return signal (e.g., target beam), which is the reflected light from a target, to extract range or velocity information
Data Source
AI summary
An FMCW LiDAR system comprises an optical source to transmit an optical beam towards a target. The LiDAR system comprises a first layer, folding optics and a second layer. The first layer comprises a silicon photonics chip coupled to an electrical power source to transmit electrical power to optical components resident on a second layer, and a plurality of different interfaces to couple the silicon photonics chip to the optical components. The folding optics is to receive the optical beam from the first layer and transmit the optical beam to the second layer. The second layer is disposed directly over the first layer. The second layer comprises the optical components including an LO to general an LO signal, and a receiver to mix a target return signal and the LO signal to extract at least one of range or velocity information related to the target.