Stacked Light Emitting Devices With Flexible Through-Hole Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light emitting devices face challenges in handling, storage, and transportation due to their rigid structures, and there is a need for a more flexible and efficient method to arrange and stack light emitting elements for enhanced brightness and weight reduction.
Innovation Solution
A stacked assembly of light emitting devices is achieved by using flexible substrate members with through-holes, allowing for the arrangement of light emitting elements on one substrate to be exposed and connected through these holes, enabling the stacking of multiple devices for increased density and separate operation, while maintaining flexibility and reducing weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If light emitting devices are arranged in a stacked assembly using flexible substrate members with through-holes, then brightness is increased and weight is reduced, but handling and storage become more complex
Solution Approach 1:
The light emitting device is divided into multiple independent light emitting elements arranged on a flexible substrate member. Each element can be individually controlled and the substrate can be flexed or rolled without damaging the elements, resolving the contradiction between achieving high brightness through multiple elements and maintaining ease of handling through flexibility
Solution Approach 2:
The patent transitions from traditional planar arrangement of light emitting elements to a stacked three-dimensional assembly where multiple substrate members are layered with through-holes allowing vertical alignment and optical interaction. This dimensional change enables increased brightness through multiple layers while the flexible substrate maintains ease of handling and storage
2Illumination intensity
If multiple light emitting elements are arranged on a single substrate member, then brightness is increased, but the device size increases
Solution Approach 1:
Instead of arranging multiple light emitting elements in a planar configuration that increases device area, the patent stacks multiple substrate members vertically with through-holes that allow light transmission and optical interaction between layers. This transforms the problem from a two-dimensional area expansion to a three-dimensional volume utilization, achieving increased brightness without proportionally increasing the device footprint
Solution Approach 2:
Multiple substrate members containing light emitting elements are nested within each other in a stacked configuration, with each substrate positioned within the boundary defined by the outer substrates. The through-holes allow the nested structure to maintain optical functionality while achieving high brightness density within a compact form factor
3Adaptability or versatility
If light emitting elements are exposed through through-holes in the substrate, then light pattern control is improved, but manufacturing precision requirements increase
Solution Approach 1:
The substrate member is segmented with multiple through-holes positioned at specific locations corresponding to individual light emitting elements or groups of elements. This segmentation enables independent control of different light patterns through selective activation of elements associated with specific through-holes, while the modular nature of the segmentation makes the manufacturing process more manageable and less precision-critical
Solution Approach 2:
The through-holes in the substrate member serve multiple functions: they allow light transmission from underlying elements, provide structural support for the stacked assembly, and enable electrical or mechanical connections between layers. This multi-functionality reduces the need for separate precision-critical components, as the same through-holes perform multiple roles that would otherwise require additional precisely-aligned features
Data Source
AI summary
A stacked assembly of light emitting devices includes a first light emitting device, a second light emitting device and a sealing member. The first light emitting device includes a first substrate member extending in a longitudinal direction and defining a plurality of through-holes, and a plurality of first light emitting elements arranged on the first substrate member. The second light emitting device is arranged to overlap with the first light emitting device. The second light emitting device includes a second substrate member extending in the longitudinal direction, and a plurality of second light emitting elements arranged on the second substrate and exposed respectively through the through-holes. The sealing member seals the first light emitting elements and the second light emitting elements.