Stacked Liquid Cooling for Electronic Devices
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Solution Overview
Problem
Existing liquid cooling systems for electronic devices are inefficient due to unsuitable fluid structures that hinder effective heat exchange between the coolant and heating elements, and maintenance is cumbersome due to the need to immerse and lift the device.
Innovation Solution
The electronic device features a modular design with arithmetic units and power supplies stacked perpendicularly to the coolant path, optimizing coolant flow and reducing device size, while radiators are integrated to enhance heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the electronic device uses conventional air-cooling heat dissipation systems, then the structure is simple and easy to manufacture, but the heat dissipation efficiency is low and noise is high
Solution Approach 1:
The patent applies liquid cooling technology instead of air cooling, using a liquid cooling plate in thermal contact with the heating element to transfer heat away from the device. The liquid coolant circulates through channels in the cooling plate, providing superior heat dissipation efficiency while reducing noise compared to air-cooling systems.
2Object-affected harmful factors
If the electronic device uses existing liquid cooling solutions obtained by removing fans, then the noise is reduced, but the heat exchange efficiency between coolant and heating element is insufficient
Solution Approach 1:
The patent introduces a liquid cooling plate as an intermediary component between the heating element and the coolant. This cooling plate is in direct thermal contact with the heating element and contains channels for coolant flow, serving as an effective heat transfer medium that enhances heat exchange efficiency while maintaining low noise operation.
Solution Approach 2:
The cooling plate is designed with localized cooling channels positioned directly at the heating element's heat generation points. This local quality approach ensures that coolant flows precisely where heat needs to be removed, maximizing heat exchange efficiency rather than relying on general convection.
3Productivity
If the electronic device is immersed in coolant for liquid cooling, then heat dissipation efficiency is improved, but maintenance operations become cumbersome requiring device removal
Solution Approach 1:
The patent segments the liquid cooling system into a modular cooling plate component that can be independently removed from the electronic device. This segmentation allows the cooling plate to be detached for maintenance or replacement without requiring removal of the entire device from the coolant, significantly improving maintenance convenience while preserving the efficient heat dissipation performance.
4Device complexity
If arithmetic units and power supply are arranged in sequence along the coolant path, then the structure is simple, but the device size is large and coolant path is long
Solution Approach 1:
The patent transitions from a linear arrangement of components along the coolant path to a stacked configuration where arithmetic units and power supply are arranged in different spatial dimensions (layers). This dimensional change allows components to be positioned perpendicular to the coolant flow direction, reducing the overall device footprint and shortening the coolant path length while maintaining structural simplicity through modular stacking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation efficiency by shortening coolant paths and enhancing coolant flow uniformity, while also simplifying maintenance by allowing individual module replacement without removing the entire device.
Implementation Method 1
radiators provided in pairs, wherein one pair of radiators are respectively attached to the upper and lower surfaces of one corresponding arithmetic module to absorb heat of the arithmetic module
Implementation Method 2
two ends of the first housing in the height direction are provided with a first opening and a second opening to form a coolant path extending along the first direction
Data Source
AI summary
An electronic device includes an arithmetic unit layer and a power supply. The arithmetic unit layer comprises at least one arithmetic unit. Each arithmetic unit comprises a first housing in a shape of cuboid. A first side direction of the first housing extends in a first direction. The first housing is provided with first and second openings at both ends in the first side direction thereof to form a coolant passage extending in the first direction. The power supply is stacked with arithmetic unit layer in a second or a third direction. A first side direction of the power supply is aligned with the first side direction of each arithmetic unit. The power supply is provided with third and fourth openings at both ends in the first side direction thereof to form a coolant passage extending in the first side direction of the power supply.