Stacked Motherboard Liquid Cooling Loops for Dense Server Heat Dissipation
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Solution Overview
Problem
The rapid increase in computing power demand in data processing centers due to cloud computing and artificial intelligence is challenging existing servers, as multiple processors generate excessive heat, leading to performance degradation and potential damage without effective heat dissipation solutions.
Innovation Solution
A liquid cooling device with stacked motherboards and liquid cooling plates connected in series and parallel, allowing coolant to simultaneously cool multiple heat generating elements, reducing space requirements and optimizing coolant utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple processors are used in series and parallel to improve computing power, then computing performance is improved, but heat generation increases causing performance degradation and potential damage
Solution Approach 1:
The patent employs liquid cooling technology by introducing a cooling liquid circulation system that flows through cooling channels in contact with processor surfaces. The cooling liquid absorbs heat from multiple processors through thermal conduction and convection, effectively controlling processor temperatures while maintaining high computing power from multiple parallel processors.
Solution Approach 2:
The cooling liquid serves as an intermediary medium between the processors and the heat dissipation system. It transfers heat from the processor surfaces through the cooling channels to external heat exchangers, enabling efficient thermal management without direct contact between processors and the external environment.
2Reliability
If separate liquid cooling loops are provided for each liquid cooling plate, then each cooling plate can be independently cooled, but space occupied by pipes increases and coolant capacity is underutilized
Solution Approach 1:
The patent merges multiple separate cooling loops into a unified liquid cooling system. Multiple liquid cooling plates are connected in parallel within a single circulation loop, allowing the cooling liquid to flow sequentially through all plates. This integration reduces the total pipe volume required while maintaining effective cooling across all processors, and maximizes coolant thermal capacity utilization.
Solution Approach 2:
The single liquid cooling loop serves multiple functions by cooling multiple processors simultaneously through the parallel-connected cooling plates. The cooling system is designed to handle thermal loads from all processors through one unified circulation path, improving space efficiency and coolant utilization.
3Volume of stationary object
If motherboards are stacked to reduce space, then space efficiency is improved, but heat dissipation becomes more difficult due to limited space for cooling components
Solution Approach 1:
The patent implements a nested cooling structure where liquid cooling plates are integrated directly onto the surfaces of stacked motherboards. The cooling channels are embedded within or adjacent to the processor mounting areas, allowing heat dissipation components to be nested within the limited vertical space of the stacked configuration. This maintains effective heat dissipation while achieving high space efficiency through vertical stacking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat from multiple heat generating elements, preventing motherboard damage, minimizing space, and ensuring stable operation while avoiding resource waste, thus enhancing server reliability and miniaturization.
Implementation Method 1
the plurality of liquid cooling plates are attached to the plurality of heat generating elements in a one-to-one correspondence... when the coolant is supplied into the liquid cooling loop, the coolant can simultaneously cool the two heat generating elements corresponding to the two liquid cooling plates in the liquid cooling loop
Implementation Method 2
when the coolant flows into the plurality of cross-layer liquid cooling loops at the same time, the liquid cooling device can effectively dissipate heat from the plurality of heat generating elements at the same time
Data Source
AI summary
A liquid cooling device and a server are provided. The liquid cooling device includes at least two motherboards that are stacked, and each motherboard being provided with at least two heat generating elements; and a plurality of liquid cooling plates attached to the plurality of heat generating elements in a one-to-one correspondence. One liquid cooling plate corresponding to one motherboard is connected to another liquid cooling plate corresponding to another motherboard in series to form a liquid cooling loop, and a plurality of liquid cooling loops are connected in parallel.