Stacked Power Conversion Module With Liquid Cooling for Sealed UPS

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Solution Overview

Problem

Conventional uninterruptible power supplies face low heat dissipation efficiency for power conversion modules, particularly in high-density device arrangements, leading to noise and reduced dustproof and waterproof capabilities.

Innovation Solution

A power conversion module design incorporating a liquid cooling board positioned between two power conversion boards, enabling efficient heat dissipation through liquid cooling, reducing noise, and eliminating the need for ventilation structures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If air cooling is used for heat dissipation in high-density device arrangements, then the structure is simple, but the heat dissipation efficiency is low

Engineering Contradiction:
Improvecooling structureVSAvoidheat dissipation efficiency
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent applies liquid cooling by introducing a liquid cooling board that contacts both power conversion boards, using liquid circulation to transfer heat away from the high-density devices, thereby achieving high heat dissipation efficiency while maintaining a relatively simple structural design

Inventive Principle:
Principle #29Pneumatics and hydraulics

2Reliability

If ventilation structures are added to improve heat dissipation, then the heat dissipation efficiency is improved, but the dustproof and waterproof level deteriorates

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoiddustproof and waterproof level
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces traditional ventilation-based air cooling with liquid cooling through a closed-loop liquid cooling board system, allowing effective heat dissipation without requiring ventilation openings, thereby maintaining both high heat dissipation efficiency and high dustproof and waterproof levels

Inventive Principle:
Principle #29Pneumatics and hydraulics

3Device complexity

If air cooling is used for heat dissipation, then the structure is simple, but noise is generated

Engineering Contradiction:
Improvecooling structureVSAvoidnoise
Core Design Contradiction:
Device complexityVSObject-generated harmful factors

Solution Approach 1:

The patent uses liquid cooling with a liquid cooling board that circulates coolant to absorb and remove heat from the power conversion boards, eliminating the need for noisy fans or blowers while maintaining simple structural design

Inventive Principle:
Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances heat dissipation efficiency, reduces noise, and improves dustproof and waterproof performance by utilizing liquid cooling without ventilation, while maintaining a compact design.

Implementation Method 1

the liquid cooling board is located between the first power conversion board and the second power conversion board... thermal conduction paths from the first power conversion board and the second power conversion board to the liquid cooling board are short

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4683445A1Power conversion module and uninterruptible power supply
Publication Date: 2026.01.21 VERTIV CORP
  • EP4683445A1 patent drawingFigure 1
  • EP4683445A1 patent drawingFigure 2
  • EP4683445A1 patent drawingFigure 3

AI summary

Provided in the present disclosure are a power conversion module and an uninterruptible power supply, which relates to the technical field of uninterruptible power supplies. The power conversion module includes a first power conversion board, a second power conversion board and a liquid cooling board. The first power conversion board, the liquid cooling board and the second power conversion board are stacked along a thickness direction of the liquid cooling board, the liquid cooling board is located between the first power conversion board and the second power conversion board, and two side surfaces of the liquid cooling board in the thickness direction are respectively connected to the first power conversion board and the second power conversion board. In this way, a heat dissipation efficiency of the power conversion module is improved.