Stacked Liquid Cooling Architecture for High-Density Chip Packages
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Solution Overview
Problem
Forming connections between substrates in microelectronics packaging leads to complications, particularly in managing thermal energy generated by increased circuit density, which existing technologies struggle to address effectively.
Innovation Solution
A package architecture incorporating a liquid cooling system with a stacked design, featuring multiple cooling layers and fins, integrated with backside power delivery networks and signal networks, utilizing silicon-based components and fusion bonding for efficient thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If circuit density is increased to provide increased computation, then computational power is improved, but thermal energy generation increases making thermal management difficult
Solution Approach 1:
The patent transitions from planar cooling to three-dimensional stacked cooling architecture. Multiple cooling layers are positioned at different vertical levels (first cooling layer contacting transistor layer, second cooling layer contacting signal layer, third cooling layer contacting backside power delivery network), enabling heat dissipation from all sides of the high-density circuit stack rather than relying on a single cooling plane.
Solution Approach 2:
The patent employs liquid cooling through fluidic conduits that circulate coolant through the stacked cooling layers. The hydraulic system includes pumps, reservoirs, and controlled fluid flow paths that efficiently transfer heat from the high-density circuits to the coolant, which then dissipates thermal energy through heat exchangers.
2Temperature
If multiple cooling layers are stacked to improve thermal management, then cooling effectiveness is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functional layers into a single integrated stacked package. The cooling layers are merged with the circuit layers (transistor layer, signal layer, backside power delivery network) into one compact three-dimensional structure, where cooling and computation functions coexist in close proximity rather than as separate assemblies.
Solution Approach 2:
The stacked cooling layers serve multiple functions simultaneously: they provide thermal management for different circuit layers, act as structural support elements, and facilitate fluid distribution throughout the package. The liquid cooling system integrates cooling, heating control, and thermal regulation in a single multi-functional architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective thermal management and reduced pressure drop across the cooling system, enhancing the performance and reliability of microelectronics packaging by efficiently dissipating heat generated by high-density circuits.
Implementation Method 1
The liquid heat exchanger may (thermally) contact the signal layer
Implementation Method 2
a first set of fins supporting cooling liquid flowing in a first direction and a second set of fins supporting cooling liquid flowing in a second direction
Data Source
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AI summary
Disclosed herein are methods, systems and devices including a first layer (116) with at least one transistor, a second layer on a first side of the first layer (116), the second layer including a signal layer , a third layer on a second side of the first layer (116), the second side opposite the first side. The third layer may include a backside power delivery device (118). A liquid heat exchanger (102) may be connected to the signal layer, and the first layer (116), the second layer, the third layer and the liquid heat exchanger (102) may be stacked. The liquid heat exchanger (102) may include a first cooling layer (210), a second cooling layer (220) connected to the first cooling layer (210), and a third cooling layer (230) connected to the second cooling layer (220), the second cooling layer (220) between the first cooling layer (210) and the third cooling layer (230). The liquid heat exchanger (102) may include an inlet contacting the second cooling layer (220) and an outlet contacting the first cooling layer (210).