Stacked Independent Loadlocks for Parallel Wafer Processing
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Solution Overview
Problem
Current semiconductor fabrication processes face limitations in throughput due to serial operations in loadlock systems, which hinder efficient transfer of wafers between atmospheric and vacuum environments, leading to reduced processing efficiency.
Innovation Solution
The implementation of stacked independent loadlocks with radial venting and pumping designs allows for parallel operations, enabling efficient transfer and processing of wafers by decoupling upper and lower loadlocks and optimizing flow paths to minimize particle contamination and enhance processing speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If serial operations are used in loadlock systems, then device complexity is reduced, but throughput is limited
Solution Approach 1:
The loadlock system is divided into multiple independent loadlock chambers (first loadlock chamber, second loadlock chamber, third loadlock chamber) that can operate in parallel. Each chamber is independently isolated and can perform venting or pumping operations simultaneously, thereby increasing throughput without requiring a single complex serial system.
Solution Approach 2:
The patent transitions from a single-dimensional serial operation to a multi-dimensional parallel operation by stacking loadlock chambers vertically and enabling simultaneous operations in different chambers. This spatial arrangement allows multiple wafer processing operations to occur concurrently, increasing throughput while maintaining manageable device complexity.
2Productivity
If parallel operations are implemented in stacked loadlocks, then throughput increases, but device complexity increases
Solution Approach 1:
The system segments wafer processing into distinct parallel pathways using multiple independent loadlock chambers. Each chamber can independently perform pumpdown or vent operations, allowing simultaneous processing of multiple wafers without requiring a single overly complex chamber, thus increasing throughput while distributing complexity across simpler modular units.
Solution Approach 2:
Multiple loadlock chambers are designed with universal functionality to perform both pumpdown and vent operations. This multi-functionality allows any chamber to handle various operational modes, increasing system throughput while avoiding the need for specialized complex chambers for each function.
3Object-affected harmful factors
If radial venting and pumping designs are used, then particle contamination is reduced, but device complexity increases
Solution Approach 1:
Instead of using conventional central venting and pumping ports that can generate particle contamination, the patent inverts the approach by implementing radial venting and pumping through annular channels at the periphery of the wafer support. This inverted configuration reduces particle contamination by avoiding central high-velocity flows while distributing the venting and pumping action around the wafer edge.
Solution Approach 2:
The radial venting and pumping design applies different flow characteristics at different locations: annular channels provide controlled radial flow at the periphery, while the wafer support area maintains a different pressure gradient. This localized quality control reduces particle contamination by optimizing flow patterns specifically where they interact with the wafer, without requiring complex global flow control systems.
4Volume of moving object
If compact stacked design is implemented, then space utilization is improved, but manufacturing precision requirements increase
Solution Approach 1:
The compact stacked design segments the loadlock system into multiple vertically arranged chambers that are independently manufactured and then assembled. This segmentation allows each chamber to be manufactured with standard precision tolerances, reducing the cumulative effect of manufacturing errors that would occur in a single monolithic structure, while achieving high space utilization through vertical stacking.
Solution Approach 2:
The stacked loadlock chambers are arranged in a nested vertical configuration where each chamber is positioned directly above or below another, maximizing space utilization. This nesting arrangement allows compact packaging while maintaining independent access and manufacturing of each chamber, thereby reducing the precision requirements compared to a single integrated chamber of equivalent volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly increases throughput by enabling simultaneous venting and pumping operations, reducing particle contamination, and compactly designing the loadlock system to accommodate dual wafer capacity, thus enhancing the efficiency of wafer handling and processing.
Implementation Method 1
transferred to a process chamber under reduced pressure. What are needed are improved methods and apparatuses of increasing throughput.
Implementation Method 2
annular designs for radial top down flow during loadlock vent and pumpdown
Data Source
AI summary
Provided are apparatuses and methods disclosed for wafer processing. Specific embodiments include dual wafer handling systems that transfer wafers from storage cassettes to processing modules and back and aspects thereof. Stacked independent loadlocks that allow venting and pumping operations to work in parallel and may be optimized for particle reduction are provided. Also provided are annular designs for radial top down flow during loadlock vent and pumpdown.