Stacked Logic Memory Module with Host Slave Modes
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Solution Overview
Problem
Current 3-D die-stacking technologies do not effectively implement computation capability in memory dies due to inefficient memory implementation processes, limiting logic capability in memory stacks and requiring either limited logic under host processor control or independent processor designs outside the stacked memory.
Innovation Solution
A system and method that includes a logic die and memory die stacked via through-silicon-vias, with the logic die configurable to manage virtual memory and operate in either slave or host modes, allowing for distributed processing and address translation, enabling autonomous operation or operation under external host processor control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If memory dies are designed with computation capability, then processing efficiency is improved, but manufacturing complexity increases due to inefficient memory implementation processes
Solution Approach 1:
The system divides computation tasks between the logic die and memory die through virtual memory management. The logic die handles complex processing while the memory die handles data storage and basic operations, allowing computation capability to be added to memory without requiring complete redesign of memory implementation processes.
Solution Approach 2:
The memory die is designed to serve dual purposes: traditional data storage and basic computation operations. By implementing virtual memory management capabilities in the memory die, it can function both as storage and as a processing unit for memory-intensive tasks, improving productivity without requiring entirely separate computation hardware.
2Device complexity
If logic capability is limited in memory stacks under host processor control, then device complexity is reduced, but adaptability decreases
Solution Approach 1:
The logic die can dynamically switch between slave mode (under host processor control) and host mode (autonomous operation). This dynamic capability allows the system to adapt to different computing scenarios: simple tasks can be handled autonomously by the memory stack while complex tasks can be coordinated by an external host processor, providing both simplicity and versatility.
Solution Approach 2:
The operating mode of the logic die can be changed based on system requirements. By adjusting the control parameter (slave vs. host mode), the system can transform from a simple memory stack to an autonomous computing system, enabling adaptability without permanently increasing device complexity.
3Ease of manufacture
If processor designs operate independently outside stacked memory, then ease of manufacture is improved, but loss of time increases due to data transfer distances
Solution Approach 1:
The logic die and memory die are physically stacked and bonded together using through-silicon vias, merging the processing and storage functions into a single compact unit. This eliminates the need for separate processor and memory components, maintaining ease of manufacture while drastically reducing data transfer time through ultra-short interconnect distances.
Solution Approach 2:
The logic die is stacked directly on top of the memory die, with through-silicon vias providing vertical interconnects through the logic die to access memory circuits below. This nested arrangement allows the processing function to be embedded within the memory structure, achieving co-location of computation and storage without complicating the manufacturing process.
Data Source
AI summary
A system, method, and computer program product are provided for a memory device system. One or more memory dies and at least one logic die are disposed in a package and communicatively coupled. The logic die comprises a processing device configurable to manage virtual memory and operate in an operating mode. The operating mode is selected from a set of operating modes comprising a slave operating mode and a host operating mode.