Stacked Magnetic Assembly Board Space Reduction
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Solution Overview
Problem
Conventional magnetic devices with multiple component assemblies require substantial printed circuit board space and thermal potting material, leading to reduced power density and increased costs due to inefficient use of space and thermal management.
Innovation Solution
The magnetic device incorporates a stacked configuration of magnetic component assemblies, where a second assembly is positioned on top of a first assembly, reducing board space requirements and optimizing enclosure usage, with longer terminal pins and standoffs for secure connection and reduced thermal material needs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If multiple magnetic component assemblies are connected side by side on the printed circuit board, then each assembly can be individually positioned, but a substantial amount of board space is required and power density is reduced
Solution Approach 1:
The patent transitions from a two-dimensional side-by-side arrangement to a three-dimensional stacked configuration. Multiple magnetic component assemblies are arranged vertically one above another, utilizing the vertical dimension to reduce the horizontal board space footprint while maintaining individual assembly positioning capabilities through separate terminal pins extending to the board
2Temperature
If windings are spaced apart from the top of the enclosure, then thermal management can be achieved, but a substantial amount of thermal potting material is needed which increases cost
Solution Approach 1:
The stacked configuration naturally reduces the vertical distance between windings and the enclosure top by utilizing the third dimension. This minimizes the required thickness of thermal potting material while still maintaining adequate thermal management, as heat can dissipate through the reduced material path
3Ease of operation
If multiple magnetic component assemblies are connected side by side, then connectivity to the printed circuit board is simplified, but power density of the magnetic device is reduced
Solution Approach 1:
By stacking assemblies vertically, the patent achieves higher power density within the same board footprint. Each assembly maintains its own terminal pins for connectivity to the printed circuit board, preserving electrical connectivity while maximizing the use of available three-dimensional space
Data Source
AI summary
A magnetic device for an electronic circuit includes a printed circuit board. A first and second magnetic component assembly can be electrically connected to the printed circuit. The second magnetic component assembly can be stacked on the first magnetic component assembly. The first magnetic component assembly can be positioned between the second magnetic component assembly and the printed circuit board. Each magnetic component assembly can include a bobbin, a winding disposed on the bobbin, and a core extending through the bobbin. A second bobbin on the second magnetic component can be positioned on either a first core or a first bobbin of the first magnetic component assembly. The stacked magnetic component configuration can help reduce the board space required to electrically connect both the first and second magnetic component assemblies to the printed circuit board, which can help increase the power density of the magnetic device.