Stacked Magnetic Inductor Structure for Lower-Cost Package Substrates
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Solution Overview
Problem
The increasing complexity of electronic devices has led to a rise in the number of substrate layers required for circuit boards, resulting in higher capital expenditures and decreased substrate yields, while maintaining mechanical properties and power delivery efficiency.
Innovation Solution
A hybrid core inductor structure is introduced, using a low-coefficient of thermal expansion (CTE) material for the core, with inductor structures extending beyond the core, and incorporating laminate layers to reduce the number of expensive buildup layers, thereby maintaining mechanical properties and improving strength and reducing warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the number of substrate layers is increased to maintain mechanical properties and power delivery efficiency, then the mechanical strength and power delivery are improved, but the manufacturing cost and capital expenditures increase
Solution Approach 1:
The patent employs a composite substrate structure combining FR-4 laminate material with embedded magnetic inductor elements. This composite approach allows the substrate to simultaneously provide mechanical support and electromagnetic functionality, eliminating the need for additional dedicated inductor components and reducing the overall layer count while maintaining both mechanical strength and electrical performance
Solution Approach 2:
The substrate layers are designed to serve multiple functions: mechanical support, power delivery, and electromagnetic inductance through embedded magnetic structures. By integrating inductor functionality directly into the substrate layers, the design achieves multi-functionality that reduces the total number of layers needed while maintaining all required performance characteristics
2Stability of the object's composition
If the number of substrate layers is increased to maintain mechanical properties, then the structural stability is improved, but the substrate yield decreases
Solution Approach 1:
The use of composite materials with embedded magnetic inductors creates a more robust substrate structure that is less prone to manufacturing defects. The integrated design reduces the number of interfaces between separate components, thereby reducing potential failure points and improving overall substrate yield while maintaining structural stability
3Strength
If expensive buildup layers are used to maintain mechanical properties, then the mechanical properties are improved, but the manufacturing cost increases
Solution Approach 1:
The patent uses cost-effective FR-4 laminate material as the base substrate and integrates magnetic inductor elements directly into it. This composite approach eliminates the need for expensive specialized buildup layers while maintaining all required mechanical and electromagnetic properties, significantly reducing material costs
Data Source
AI summary
An electronic device and associated methods are disclosed. In one example, the electronic device includes a package with integrated inductors. In selected examples, the package includes a core layer having a core thickness and through holes. The package further includes inductor structures within the through holes, such that an inductor structure has a length exceeding the core thickness.