Stacked In-Vehicle Mainboards With Shared Radiator Cooling
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Solution Overview
Problem
Conventional in-vehicle computing apparatuses face challenges in heat dissipation, particularly in intelligent vehicles with increased computing demands, where natural wind-based heat dissipation is insufficient, leading to larger size and increased space occupation.
Innovation Solution
The design incorporates two stacked mainboards with a shared radiator and sealing plates for efficient heat dissipation, utilizing a 1+1 redundancy configuration, and an air-cooling system with fan modules to enhance airflow and reliability, reducing the overall volume and improving waterproofing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two separate in-vehicle computing apparatuses are disposed for 1+1 redundancy design, then system reliability is improved, but the space occupied and device complexity increase
Solution Approach 1:
The patent merges two separate in-vehicle computing apparatuses into a single integrated device. The housing contains both a first computing apparatus and a second computing apparatus stacked vertically, sharing common structural elements, heat dissipation pathways, and control systems. This integration maintains the 1+1 redundancy configuration while reducing the overall space occupied compared to two separate apparatuses.
Solution Approach 2:
The patent implements a nested structure where the second computing apparatus is positioned directly above the first computing apparatus within the same housing. The heat dissipation components are arranged in a nested configuration with heat dissipation fins extending from both apparatuses into a shared heat dissipation space. This nesting approach maximizes space utilization while maintaining functional independence of each computing apparatus.
2Device complexity
If conventional natural wind heat dissipation is used, then device simplicity is maintained, but heat dissipation capability is insufficient for high computing demands
Solution Approach 1:
The patent transitions from passive natural convection to active forced convection heat dissipation. A heat dissipation fan is integrated into the housing to actively drive air flow through the heat dissipation fins. This dynamic approach allows the system to adapt to varying heat generation levels by controlling fan speed, ensuring sufficient heat dissipation capability for high computing demands while maintaining reasonable system complexity.
Solution Approach 2:
The patent employs a pneumatic heat dissipation system where a fan generates forced air flow through channels and across heat dissipation fins. The air flow is directed through specific pathways to maximize heat transfer from the computing apparatus components. This pneumatic approach significantly enhances heat dissipation capability compared to natural convection while adding controlled complexity to the thermal management system.
3Volume of stationary object
If computing apparatus size is reduced for better space efficiency, then volume is decreased, but heat dissipation performance may be compromised
Solution Approach 1:
The patent utilizes vertical stacking to arrange computing components in the third dimension rather than spreading them horizontally. The first and second computing apparatuses are positioned one above the other, with heat dissipation fins extending vertically. This dimensional transition allows compact horizontal footprint while maintaining adequate heat dissipation surface area through vertical fin structures and layered component arrangement.
Solution Approach 2:
The patent implements localized heat dissipation structures where heat dissipation fins are positioned specifically around high-heat-generating components of each computing apparatus. The heat dissipation fan is strategically placed to create optimized air flow patterns that target critical thermal zones. This localized approach ensures effective heat dissipation performance within the reduced overall volume by concentrating cooling resources where most needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the volume occupied by the computing apparatus while maintaining or exceeding the heat dissipation performance of two separate units, ensuring reliable operation and improved space efficiency within the vehicle.
Implementation Method 1
a radiator (10) that is disposed between the two mainboards and connected to each mainboard in a thermally conductive manner
Implementation Method 2
an air-cooling system with fan modules to enhance airflow
Data Source
Figure 1~2
Figure 3a~3b
Figure 4a~4b
AI summary
This application provides an in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle. The in-vehicle computing apparatus includes two stacked mainboards, and further includes: a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards; and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator. In this way, heat on the in-vehicle computing apparatus can be dissipated through a shared radiator, to reduce a volume of the computing apparatus in the intelligent vehicle and improve a heat dissipation capability of the computing apparatus in the intelligent vehicle.