Stacked Semiconductor Memory Layout for BTI-Stable Multi-Layer Reads
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High integration of semiconductor memory devices requires efficient read operations across multiple memory layers, but existing methods increase the area for connecting contact electrodes, leading to reduced performance and potential data loss due to Bias Temperature Instability (BTI) effects.
Innovation Solution
The semiconductor memory device employs a configuration with two transistor regions in each memory layer, where transistors are electrically connected in common via a conductive layer, reducing the need for extensive contact electrodes and incorporating a decode circuit to switch transistor states during read operations, thereby minimizing BTI influence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If contact electrodes are extensively used to connect transistors in each memory layer, then electrical connectivity is improved, but the area for hook-up regions increases
Solution Approach 1:
The patent merges the connection function of multiple contact electrodes into a single common conductive layer that electrically connects transistors in each memory layer. This consolidation maintains electrical connectivity while significantly reducing the area occupied by hook-up regions, as the common conductive layer serves multiple transistors simultaneously rather than requiring individual contact electrodes for each transistor.
Solution Approach 2:
The common conductive layer performs multiple functions: it acts as a gate electrode for transistors in one memory layer, a source/drain electrode for transistors in another memory layer, and provides electrical connection across multiple layers. This multi-functionality eliminates the need for separate contact electrodes, reducing hook-up region area while maintaining connectivity.
2Quantity of substance
If transistors are densely arranged to increase integration, then memory capacity is improved, but electrostatic capacity between gate electrodes increases causing operation instability
Solution Approach 1:
The patent transitions from planar transistor arrangement to a three-dimensional stacked memory structure with multiple memory layers arranged vertically. This dimensional change allows transistors to be densely packed in the vertical direction while maintaining adequate horizontal spacing between gate electrodes in each layer, thereby increasing memory capacity without excessively increasing electrostatic capacity between gates.
Solution Approach 2:
The patent divides the memory structure into multiple separate memory layers, each containing transistors with their own gate electrodes. This segmentation isolates the electrostatic fields of gate electrodes in different layers, reducing the overall electrostatic capacity between gates while allowing high-density arrangement through vertical stacking.
3Speed
If read operations are performed on multiple memory layers simultaneously, then data access speed is improved, but BTI effects increase causing potential data loss
Solution Approach 1:
The patent implements periodic switching of transistor states during read operations using a decode circuit. Instead of maintaining continuous high-voltage states that exacerbate BTI effects, the system periodically switches transistors between ON and OFF states, allowing recovery periods that mitigate cumulative BTI damage while still enabling rapid data access from multiple memory layers.
Solution Approach 2:
The patent uses a decode circuit to dynamically switch transistor states during read operations. This dynamic control allows the system to selectively activate only the transistors needed for current read operations, minimizing the time that transistors are subjected to high stress conditions that cause BTI effects, thereby protecting data integrity while maintaining fast access speeds.
Data Source
AI summary
A semiconductor memory device includes: memory units arranged in a first direction; first semiconductor layers arranged in the first direction and electrically connected to the memory units; first gate electrodes arranged in the first direction and opposed to the first semiconductor layers; a first wiring extending in the first direction and connected to the first semiconductor layers; second wirings arranged in the first direction, and connected to the first gate electrodes; second semiconductor layers arranged in the first direction and disposed at first end portions of the second wirings; second gate electrodes arranged in the first direction and opposed to the second semiconductor layers; third semiconductor layers arranged in the first direction and disposed at second end portions of the second wirings; and third gate electrodes arranged in the first direction and opposed to the third semiconductor layers.


