Stacked Memory Buffer Die Layout for Heat and Power Separation
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Solution Overview
Problem
Current memory devices face challenges in heat management and integration of large-capacity memories due to limitations in chip size and interface compatibility between logic chips and memory chips.
Innovation Solution
A memory device architecture that includes first and second core dies stacked in a specific direction, with a buffer die having distinct physical layers for data output and power signal reception, facilitating efficient data transfer and power management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple memory chips are coupled to increase capacity, then memory capacity is improved, but heat management performance deteriorates
Solution Approach 1:
The patent transitions from horizontal coupling of memory chips to vertical stacking in the third dimension. Multiple memory chips are stacked vertically and connected through through-silicon vias (TSVs), enabling increased capacity while improving heat dissipation through the vertical architecture and reduced lateral heat accumulation.
Solution Approach 2:
The memory system is segmented into multiple independent memory chips that can be stacked vertically. Each chip operates as a separate unit with its own heat management, preventing heat accumulation in a single large chip and enabling modular scaling of capacity.
2Volume of moving object
If chip size is decreased to improve integration, then device density is improved, but heat management performance deteriorates
Solution Approach 1:
The patent moves heat dissipation pathways into the vertical dimension through TSVs and stacked architecture. Smaller chips stacked vertically provide increased surface area for heat dissipation and shorter heat conduction paths to heat sinks, improving thermal management despite reduced individual chip size.
3Adaptability or versatility
If different interface types are used for logic chips and memory chips, then device functionality is improved, but coupling difficulty increases
Solution Approach 1:
The patent employs a universal interface architecture where the buffer die incorporates standardized interfaces (such as UCIe) that can communicate with both logic chips and memory chips. This multi-functional interface design enables heterogeneous coupling while maintaining signal integrity and simplifying the coupling process.
Solution Approach 2:
The buffer die acts as an intermediary between logic chips and memory chips, providing interface conversion and signal conditioning. This mediator enables communication between different interface types while maintaining the benefits of specialized interfaces for each component type.
4Device complexity
If physical layers are integrated in a single chip to reduce complexity, then device complexity is reduced, but power management efficiency deteriorates
Solution Approach 1:
The patent segments the physical layers into separate functional blocks within the buffer die - a first physical layer for data signal transmission and a second physical layer for power signal reception. This segmentation allows independent optimization of signal integrity and power management, improving power efficiency while maintaining manageable complexity through modular design.
Data Source
AI summary
A memory device includes: first and second core dies that include a plurality of memory cells and are stacked in a first direction, and a buffer die that is stacked with the first and second core dies in the first direction and includes a first physical layer and a second physical layer, wherein the buffer die is configured to output data of the plurality of memory cells through the first physical layer, wherein the data of the plurality of memory cells is provided from the first and second core dies through through-vias that pass through the first and second core dies in the first direction, and wherein the second physical layer is separated from the first physical layer and is configured to receive power signals from outside.