Stacked Memory Die ID Assignment via TSV Pulse Counting
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Solution Overview
Problem
In stacked memory devices, efficiently detecting and assigning unique identification (ID) information to individual dice during initialization is challenging, especially in densely packed configurations where conductive paths and ID circuits must effectively communicate and configure memory arrays without increasing circuit area or reducing performance.
Innovation Solution
The implementation of conductive paths, including through-silicon vias (TSVs), and ID circuits within the dice stack allows for the detection and assignment of ID information during the initialization period, enabling each die to be recognized and configured uniquely, with control circuits counting clock pulses to determine the number of dice and assign IDs, optimizing memory configurations and access.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor dice are stacked to increase memory capacity in limited space, then storage density is improved, but detection and identification of individual dice becomes more difficult
Solution Approach 1:
The patent assigns unique identification information to each individual die within the stacked memory device, enabling segmentation of the multi-die system into individually identifiable units. This allows the memory controller to detect and manage each die separately despite their physically stacked configuration, resolving the detection difficulty while maintaining high storage density.
Solution Approach 2:
The patent introduces an intermediary detection mechanism that facilitates communication between the memory controller and individual dice through the stacked structure. This intermediary system enables the controller to identify and configure each die uniquely without requiring physical access or increasing the stacked density, thus solving the detection problem while preserving memory capacity.
2Difficulty of detecting and measuring
If conductive paths and ID circuits are added to detect and assign IDs to each die, then identification capability is improved, but circuit area increases
Solution Approach 1:
The patent designs the conductive paths and control circuits to serve multiple functions: they enable both data transmission between dice and ID detection/assignment operations. This multi-functionality allows the same circuit infrastructure to support identification capabilities without requiring additional dedicated circuits, thereby avoiding circuit area expansion while improving identification capability.
Solution Approach 2:
The patent merges the ID detection and assignment functions with the existing memory control circuits, combining multiple functionalities into a unified circuit system. This integration allows the memory controller to perform both memory operations and ID management through shared circuitry, eliminating the need for separate ID circuits and preventing circuit area increase.
3Manufacturing precision
If initialization procedures are extended to detect and assign IDs to all dice, then configuration accuracy is improved, but initialization time increases
Solution Approach 1:
The patent performs ID detection and assignment during the initialization period, conducting configuration actions before the memory device enters full operation. By completing all ID detection and assignment tasks during this preliminary phase, the system ensures accurate configuration of all dice without requiring additional time during operational phases, thus maintaining configuration accuracy while minimizing total initialization time.
Solution Approach 2:
The patent implements a continuous initialization process that systematically detects and assigns IDs to all dice in sequence during the initialization period. This continuous operation ensures that every die is properly configured without interruption or repetition, achieving complete configuration accuracy while optimizing the duration of the initialization process by eliminating redundant operations.
Data Source
AI summary
Various embodiments include apparatus and methods having circuitry to detect and/or assign identification information to dice arranged in a stack and coupled by conductive paths.