Stacked Memory Die ID Assignment Through Sequential Control Transfer
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Solution Overview
Problem
Conventional methods for assigning identification (ID) to semiconductor dice in stacked memory devices, such as wire bond programming and fuse programming, are inefficient, especially when dice lack wire bonds, and require additional record-keeping efforts.
Innovation Solution
A method and apparatus that utilize connections with logic AND gates to sequentially transfer control information and IDs to each die in a stack, allowing each die to receive and store its unique ID, enabling efficient ID assignment without the need for wire bonds and reducing record-keeping complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If wire bond programming is used to assign ID to dice, then ID assignment can be performed, but it is unsuitable for stacked dice without wire bonds
Solution Approach 1:
The patent replaces the mechanical wire bond programming system with an electrical field-based programming system. The control circuit uses electrical signals transmitted through the stack to program IDs directly into dice without requiring physical wire bonds, thus adapting to stacked dice configurations while maintaining ID assignment capability
Solution Approach 2:
The patent introduces a control circuit as an intermediary between the ID assignment process and the dice. This control circuit mediates the programming process by generating and transmitting control signals through the stack, enabling ID assignment to dice that lack wire bonds while eliminating the need for external record-keeping
2Productivity
If fuse programming is used to assign ID to dice, then ID can be assigned before stacking, but additional record keeping is required
Solution Approach 1:
The patent merges the ID assignment function with the stack structure itself. The control circuit integrates the programming capability directly into the stack, allowing IDs to be assigned after stacking without requiring separate record-keeping systems. The stack structure becomes both the physical arrangement and the programming medium
Solution Approach 2:
The patent enables the stack to perform its own ID assignment automatically. The control circuit within the stack generates control signals that program IDs directly into the dice based on their positions, making the system self-sufficient and eliminating the need for external record-keeping processes
3Reliability
If individual ID assignment is performed before stacking, then each die can be identified, but the process becomes more complex with record keeping
Solution Approach 1:
The patent performs preliminary positioning of dice in the stack before ID assignment. The control circuit uses the known positions of dice within the stack to automatically determine which ID to assign to each die, eliminating the need for separate tracking and record-keeping while maintaining assignment accuracy
Data Source
AI summary
Some embodiments include apparatus and methods having dice arranged in a stack. The dice include at least a first die and a second die, and a connection coupled to the dice. The connection may be configured to transfer control information to the first die during an assignment of a first identification to the first die and to transfer the control information from the first die to the second die during an assignment of a second identification to the second die.